Method for additively manufacturing components

Abstract

An example method of making a component includes providing a digital model of a component to software, the software operable to slice the model into layers and raster each layer into segments, the segments delineated by raster lines. The method further includes depositing a layer of powder onto a platform, compacting the layer of power into a compacted layer, sintering the compacted layer along lines corresponding to the raster lines using a laser, wherein the laser operates at a first power and a first scan speed, the first power being between about 200 and 230 W, then sintering the compacted layer along a perimeter of the compacted layer using the laser to form a unitary layer, wherein the laser operates at a second power and a second scan speed, the second power being between about 100 and 200 W. An apparatus for making a component is also disclosed.

What is claimed is: 
     
         1 . A method of making a component, comprising:
 providing a digital model of a component to a software program, the software program operable to slice the digital model into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines;   depositing a first layer of powdered material onto a platform;   compacting the first layer of powered material into a first compacted layer;   sintering the first compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at a first power and a first scan speed, the first power being between about 200 and 230 W; and   sintering the first compacted layer along a perimeter of the first compacted layer using the laser to form a first unitary layer, wherein the laser operates at a second power and a second scan speed, the second power being between about 100 and 200 W.   
     
     
         2 . The method of  claim 1 , wherein a ratio of the first power to the second power is less than about 2.5. 
     
     
         3 . The method of  claim 2 , wherein the ratio of the first power to the second power is between about 1.15 and 2. 
     
     
         4 . The method of  claim 1 , wherein the first layer of powdered material has a first thickness after the depositing step, and wherein the compacting step compacts the first layer of powdered material to a second thickness that is by between about 40% and 60% of the first thickness. 
     
     
         5 . The method of  claim 4 , wherein the second thickness is between about 20 and 40 μm (0.79 and 1.57 mil). 
     
     
         6 . The method of  claim 1 , wherein a distance between the raster lines is between about 30 μm and 100 μm (1.18 and 3.94 mils). 
     
     
         7 . The method of  claim 6 , wherein the offset includes an outline offset of between about −150 and +150 μm (−5.91 to +5.91 mils) and a Heart offset of between about −150 and +150 μm (−5.91 to +5.91 mils). 
     
     
         8 . The method of  claim 7 , wherein the outline offset is between about −50 and −90 μm (−1.97 and −3.54 mil) and the Heart offset is between about −80 and −100 μm (−3.15 and −3.94 mil). 
     
     
         9 . The method of  claim 1 , wherein a controller is operable to receive signals from the software program and direct the laser during the first and second sintering steps. 
     
     
         10 . The method of  claim 1 , further comprising heat treating the first unitary layer and second unitary layer, wherein the heat treatment is performed in a hot isostatic press. 
     
     
         11 . The method of  claim 10 , wherein the first unitary layer has an average grain size of between about 40 and 60 μm (1.57 and 2.36 mils) after the heat treatment. 
     
     
         12 . The method of  claim 11 , wherein the first unitary layer has generally equiaxed grain shapes. 
     
     
         13 . The method of  claim 10 , wherein the first unitary layer has an average density of greater than about 99% after the heat treatment. 
     
     
         14 . The method of  claim 1 , wherein the first scan speed is between about 2000 and 2500 mm/second (78.74 and 98.43 in/second) and the second scan speed is between about 250 and 750 mm/second (9.84 and 29.53 in/second) and the second scan speed it between about. 
     
     
         15 . The method of  claim 14 , wherein the first scan speed is between about 2250 and 2350 mm/second (88.58 and 92.52 in/second) and the second scan speed is between about 400 and 600 mm/second (15.75 and 23.62 in/second). 
     
     
         16 . The method of  claim 1 , further comprising:
 depositing a second layer of powdered material onto the first unitary layer;   compacting the second layer of powered material into a second compacted layer;   sintering the second compacted layer along lines corresponding to the digital raster lines using a laser, wherein the laser operates at the first power and the first scan speed; and   sintering the second compacted layer along a perimeter of the second compacted layer using the laser to form a second unitary layer, wherein the laser operates at the second power and the second scan speed.   
     
     
         17 . The method of  claim 16 , wherein the second layer of powdered material has a first t thickness after the depositing step, and wherein the compacting step compacts the second layer of powdered material to a second thickness, and the second thickness is between about 20 and 40 μm (0.79 and 1.57 mil). 
     
     
         18 . The method of  claim 16 , wherein the thickness of the second compacted layer is between about 40 and 60% of the thickness of the first compacted layer. 
     
     
         19 . The method of  claim 1 , wherein the material is a powered nickel alloy, and wherein the component is a heat exchanger is operable at temperatures greater than 1600° F. (871° C.). 
     
     
         20 . An apparatus for making a component, comprising:
 a controller operable to receive signals from a software program, the software program operable to slice a digital model of a component into digital layers and raster each digital layer into digital segments, the digital segments delineated by digital raster lines;   a material source operable to provide material to a platform;   a compactor operable to compact the material; and   a laser operable to sinter the material, the laser movable by the controller to sinter the material along the raster lines at a first power and a first speed and along a perimeter of the component at a second power and a second scan speed, wherein the first power is between about 200 and 230 W and the second power is between about 100 and 200 W.