Electronic assemblies including an electronic device mounted on a non-planar substrate

Abstract

An electronic assembly including a non-planar substrate and an electronic device is disclosed. The non-planar substrate is defined by a flat section adjoining a curved section, wherein an internal electrical conductor extends through the curved section in a way that conforms to a shape of the curved section. The electronic device is mounted to the flat section of the non-planar substrate and is electrically coupled to the internal electrical conductor.

1 - 20 . (canceled). 
     
     
         21 . An electronic assembly, comprising:
 a non-planar substrate, wherein the non-planar substrate is defined by a flat section adjoining a curved section, and wherein an internal electrical conductor extends through the curved section in a way that conforms to a shape of the curved section; and   an electronic device mounted to the flat section of the non-planar substrate, wherein the electronic device is electrically coupled to the internal electrical conductor.   
     
     
         22 . The electronic assembly of  claim 21 , wherein the non-planar substrate comprises a low-temperature co-fired ceramic. 
     
     
         23 . The electronic assembly of  claim 21 , wherein the curved section comprising the internal electrical conductor provides an electrically interconnecting standoff for the electronic device. 
     
     
         24 . The electronic assembly of  claim 21 , wherein the flat section comprises a top surface and a bottom surface, and wherein the electronic device is mounted to one of the top surface or the bottom surface. 
     
     
         25 . The electronic assembly of  claim 24 , wherein the electronic device comprises a first electronic device, and wherein the electronic assembly further comprises a second electronic device;
 wherein the non-planar substrate is further defined by a second curved section adjoining the flat section, and wherein a second internal electrical conductor extends through the second curved section in a way that conforms to a shape of the second curved section; and   wherein the second electronic device is mounted to one of the top surface or the bottom surface of the flat section, and wherein the second electronic device is electrically coupled to the second internal electrical conductor.   
     
     
         26 . The electronic assembly of  claim 25 , wherein the first electronic device and the second electronic device are both mounted to the top surface of the flat section or both mounted to the bottom surface of the flat section. 
     
     
         27 . The electronic assembly of  claim 25 , wherein the first electronic device is mounted to the top surface of the flat section and the second electronic device is mounted to the bottom surface of the flat section. 
     
     
         28 . The electronic assembly of  claim 25 , further comprising:
 a third electronic device;   wherein a third internal electrical conductor extends through the second curved section in a way that conforms to the shape of the second curved section, and wherein the third internal electrical conductor is separated from the second internal electrical conductor by at least one layer of non-planar substrate material; and   wherein the third electronic device is mounted to one of the top surface or the bottom surface of the flat section, and wherein the third electronic device is electrically coupled to the third internal electrical conductor.   
     
     
         29 . The electronic assembly of  claim 21 , further comprising:
 a second substrate comprising an internal electrical conductor;   wherein the non-planar substrate is mounted to the second substrate at the curved section, and wherein the internal electrical conductor of the non-planar substrate is electrically coupled to the internal electrical conductor of the second substrate.   
     
     
         30 . The electronic assembly of  claim 21 , wherein the curved section comprises an S-shaped section, a J-shaped section, or a C-shaped section. 
     
     
         31 . The electronic assembly of  claim 21 , wherein the internal electrical conductor extends from the flat section through the curved section to a bottom surface of the curved section. 
     
     
         32 . An electronic assembly, comprising:
 a non-planar substrate, wherein the non-planar substrate is defined by a planar section adjoining at least two arcuate sections, and wherein at least one internal electrical conductor extends through one or more than one of the arcuate sections in a way that conforms to a shape of the respective arcuate section; and   an electronic device mounted to the planar section of the non-planar substrate, wherein the electronic device is electrically coupled to one or more than one internal electrical conductor of the one or more than one of the arcuate sections.   
     
     
         33 . The electronic assembly of  claim 32 , wherein each of the at least one internal electrical conductor is embedded between internal layers of the non-planar substrate. 
     
     
         34 . The electronic assembly of  claim 32 , wherein the non-planar substrate is configured to be mounted on a second substrate. 
     
     
         35 . The electronic assembly of  claim 34 , wherein the second substrate is a planar substrate or a non-planar substrate. 
     
     
         36 . The electronic assembly of  claim 32 , wherein the non-planar substrate comprises a low-temperature co-fired ceramic. 
     
     
         37 . The electronic assembly of  claim 32 , wherein the one or more than one of the arcuate sections comprising the at least one internal electrical conductor provides an electrically interconnecting standoff for the electronic device. 
     
     
         38 . The electronic assembly of  claim 32 , wherein each arcuate section comprises an S-shaped section, a J-shaped section, or a C-shaped section. 
     
     
         39 . The electronic assembly of  claim 21 , wherein each internal electrical conductor extends from the planar section through the one or more than one of the arcuate sections to a bottom surface of the respective one or more than one of the arcuate sections. 
     
     
         40 . An electronic assembly, comprising:
 a non-planar low-temperature co-fired ceramic substrate, wherein the non-planar substrate is defined by a planar section adjoining at least two arcuate sections located at a periphery of the planar section, and wherein at least one internal electrical conductor is embedded between internal layers of the non-planar substrate and extends through one or more than one of the arcuate sections in a way that conforms to a shape of the respective arcuate section; and   an electronic device mounted to the planar section of the non-planar substrate, wherein the electronic device is electrically coupled to one or more than one internal electrical conductor of the one or more than one of the arcuate sections.