Implant device and method of making the same

Abstract

The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as photoresist is used as glue to attach a chip to the targeted thin-film (e.g., parylene) substrate so that the chip is used as an attachment to prevent delamination.

1 .- 10 . (canceled) 
     
     
         11 . A biocompatible package for low density connections, the biocompatible package comprising:
 a feedthrough layer;   an application specific integrated circuit (ASIC) face down on the feedthrough layer;   a substrate attached to the ASIC adapted for off-chip components and wire bonded to the feedthrough layer; and   metal walls adjacent the feedthrough layer; and a lid to encase and make the biocompatible package.   
     
     
         12 . The biocompatible package of  claim 11 , wherein the feedthrough layer is a biocompatible material. 
     
     
         13 . The biocompatible package of  claim 12 , wherein the biocompatible material is ceramic. 
     
     
         14 . The biocompatible package of  claim 11 , wherein the substrate is a printed circuit board (PCB). 
     
     
         15 . The biocompatible package of  claim 11 , wherein the lid is metal. 
     
     
         16 . The biocompatible package of  claim 11 , wherein an off-chip component is connected to the PCB by soldering or by using conductive epoxy. 
     
     
         17 . The biocompatible package of  claim 11 , wherein the PCB is attached to the backside of the ASIC by a non-conductive epoxy. 
     
     
         18 . The biocompatible package of  claim 11 , wherein the PCB is wire bonded to the feedthrough layer to make an electrical connection. 
     
     
         19 . The biocompatible package of  claim 11 , wherein solder balls are used to make an electrical connection between the ASIC and the feedthrough layer. 
     
     
         20 . The biocompatible package of  claim 11 , wherein the metal walls are hermetically encased with a metal lid. 
     
     
         21 . The biocompatible package of  claim 11 , wherein said package is designed for low-density connections. 
     
     
         22 . The biocompatible package of  claim 11 , wherein said package has about 1 to about 100 connections in a millimeter area. 
     
     
         23 . The biocompatible package of  claim 11 , wherein the feedthrough layer serves as the interface between the enclosed circuit and a flexible electrode array. 
     
     
         24 . The biocompatible package of  claim 16 , wherein an ASIC and off-chip components are on different planes. 
     
     
         25 . The biocompatible package of  claim 16 , wherein an ASIC and off-chip components are on the same plane. 
     
     
         26 . The biocompatible package of  claim 11 , wherein the metal lid and the metal walls are laser welded to hermetically seal.