US2018355487A1PendingUtilityA1
Film material and cold spray method
Assignee: TATSUTA ELECTRIC WIRE & CABLE CO LTDPriority: Jun 8, 2017Filed: Apr 13, 2018Published: Dec 13, 2018
Est. expiryJun 8, 2037(~10.8 yrs left)· nominal 20-yr term from priority
Inventors:Masaki Hirano
C23C 24/08B23K 35/36B23K 35/3612C23C 24/04C23C 24/082C23C 24/087B23K 35/0244B23K 35/3033
51
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Claims
Abstract
Provided are: a film material for use in a cold spray device; and a cold spray method, each of the film material and the cold spray method enabling an improvement in rate of adhesion of a spray material to a base material. A film material for use in a cold spray device ( 100 ) and to be sprayed onto a base material ( 20 ) includes a spray material and flux powder.
Claims
exact text as granted — not AI-modified1 . A film material for use in a cold spray device and to be sprayed onto a base material, comprising:
a spray material; and flux powder.
2 . The film material as set forth in claim 1 , wherein:
the spray material is nickel; the flux powder is soldering flux powder; and the film material comprises the spray material and the flux powder in a volume ratio ranging from 1 : 3 to 3 : 1 .
3 . A cold spray method comprising the steps of:
mixing a spray material and flux powder so as to produce a film material; and spraying the film material, together with a carrier gas, onto a base material so as to form a film on the base material.
4 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a temperature of not less than 250° C. and not more than 340° C.
5 . The cold spray method as set forth in claim 3 , wherein the carrier gas is set to a pressure of not more than 1 Mpa.Join the waitlist — get patent alerts
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