Wired rubber contact and method of manufacturing the same

Abstract

A wired rubber contact including a lower film, an upper film, a plurality of conductive wires, a rubber layer, and a film guide. The lower film includes a plurality of lower electrode parts formed in openings. A periphery of the upper film is disposed within an interface between the central area and the peripheral area. The conductive wires are disposed between the lower film and the upper film, and connect between the lower electrode parts and the upper electrode parts. The rubber layer includes elastic material. A periphery of the rubber layer is protruded toward an outer side from the periphery of the upper film. The rubber layer maintains a constant distance between the lower film and the upper film. The film guide is disposed in the peripheral area of the lower film along a side surface of the rubber layer and integrally formed with the lower film.

1 . A method of manufacturing a wired rubber contact, comprising:
 forming a lower electrode part passing through each of openings of a lower film, the lower film including a central area in which the openings are formed and a peripheral area surrounding the central area;   attaching a supporting plate in the peripheral area, the supporting plate preventing the lower film from drifting, a center of the supporting plate being opened to expose the central area;   combining conductive wires on the lower electrode part, the conductive wires being arranged in a vertical direction;   forming a mold on the supporting plate, the mold surrounding the central area;   disposing a primitive upper film on the conductive wire and the mold to combining upper end portions of the conductive wires to the upper electrode parts, the primitive upper film including a plurality of openings and a plurality of upper electrode parts formed in the openings;   forming a rubber layer in an internal space defined by the lower film, the mold, and the primitive upper film;   cutting the primitive upper film along a cutting line disposed within an interface between the central area and the peripheral area of the lower film to form an upper film, a periphery of the upper film being disposed within a periphery of the rubber layer;   removing the mold and the supporting plate; and   attaching a film guide onto the peripheral area of the lower film,   wherein the lower film is attached to a lower surface of the rubber layer, and the upper film is attached to an upper surface of the rubber layer,   wherein the wired rubber contact is interposed between a semiconductor chip and a stage,   wherein the semiconductor chip is disposed on the upper film, and electrode pads of the semiconductor chip make contact with the upper electrode parts exposed on the upper film, and   wherein the stage is disposed under the film assembly, and the lower electrode parts exposed under the lower film make contact with electrode pads of the stage.   
     
     
         2 . The method of  claim 1 , wherein the film guide is attached by integrally forming the film guide with the lower film. 
     
     
         3 . A method of manufacturing a wired rubber contact, comprising:
 parallelly aligning a primitive lower film and a primitive upper film, the primitive lower film having a central area in which a plurality of openings are formed and a peripheral area surrounding the central area and including a plurality of lower electrode parts formed in the openings, the primitive upper film including a plurality of openings and a plurality of upper electrode parts formed in the openings;   connecting the lower electrode parts to the upper electrode parts through conductive wires;   injecting and solidifying silicon rubber between the primitive upper film and the primitive lower film;   cutting the primitive upper film, the solidified silicon rubber, and the primitive lower film along an interface between the central area and the peripheral are to form an upper film, a rubber layer, and a lower film;   attaching a sticky tape to cover an entire of a lower surface of a film guide, the film guide having a central opening, the central opening having a size equal to or greater than the central area;   attaching a lower surface of the lower film to the sticky tape exposed through the central opening;   combining the rubber layer with the film guide; and   removing the sticky tape,   wherein the lower film is attached to a lower surface of the rubber layer, and the upper film is attached to an upper surface of the rubber layer,   wherein the wired rubber contact is interposed between a semiconductor chip and a stage,   wherein the semiconductor chip is disposed on the upper film, and electrode pads of the semiconductor chip make contact with the upper electrode parts exposed on the upper film, and   wherein the stage is disposed under the film assembly, and the lower electrode parts exposed under the lower film make contact with electrode pads of the stage.   
     
     
         4 . The method of  claim 3 , wherein the lower electrode part and the upper electrode part are connected by the conductive wires by:
 transporting the lower film and the upper film along two conveyors, the conveyors being arranged to face each other, an interval of upper portions of the conveyors being greater than an interval of lower portions thereof; and   sequentially connecting the lower electrode parts to the upper electrode parts by the conductive wires as the lower film and the upper film being transported.   
     
     
         5 . The method of  claim 3 , wherein the lower electrode parts fill the openings of the primitive lower film, and the upper electrode parts are formed along a periphery of the openings of the primitive upper film to form throughholes in a center thereof,
 and wherein the lower electrode part and the upper electrode part are connected by the conductive wires by:   arranging the primitive upper film and the primitive lower film so that the lower electrode part is exposed through the throughholes of the upper electrode part;   connecting one end portions of the conductive wires to upper surfaces of the lower electrode parts, and connecting another end portions of the conductive wires to upper surfaces or inner surfaces of the upper electrode parts; and   separating a distance between the primitive upper film from the primitive lower film so that the conductive wires are interposed between the primitive upper film and the primitive lower film.   
     
     
         6 . The method of  claim 5 , wherein the connecting the lower electrode parts and the upper electrode parts by the conductive wires further comprises soldering the upper electrode parts to fill the throughholes.