US2018336924A1PendingUtilityA1
Recording medium, method of manufacturing fullerene thin film, recording reproducing apparatus, information recording method, and information reading method
Est. expiryJun 30, 2035(~8.9 yrs left)· nominal 20-yr term from priority
C01B 32/156G11B 9/149G11B 5/851G11B 9/14G11B 9/04G11B 5/73911
60
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Claims
Abstract
According to the present invention, there is provided a recording medium comprising a substrate, a platinum layer formed on the substrate and having a (111) plane preferentially oriented, and a fullerene single crystal thin film formed on the platinum layer, and configured to be a recording layer, wherein an average value of average surface roughness Ra's with respect to four or more visual fields measured by using an atomic force microscope in a surface of the fullerene thin film is 0.5 nm or less.
Claims
exact text as granted — not AI-modified1 . A method of manufacturing a fullerene thin film, comprising:
a step of forming a platinum layer by sputtering on a substrate; and a step of forming a fullerene layer by vacuum evaporation on the platinum layer.
2 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein the fullerene layer is a single crystal thin film.
3 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein a temperature of the substrate is 400° C. to 900° C. in the step of forming the platinum layer.
4 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein the temperature of the substrate is 400° C. to 900° C., and annealing is performed after the step of forming the platinum layer.
5 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein the substrate is a sapphire substrate.
6 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein the temperature of the substrate is 100° C. to 200° C. in the step of forming the fullerene layer.
7 . The method of manufacturing a fullerene thin film according to claim 1 ,
wherein the temperature of the substrate is 100° C. to 200° C., and annealing is performed after the step of forming the fullerene layer.Join the waitlist — get patent alerts
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