Anodization involving a lubricant

Abstract

One example provides a method. The method includes etching a portion of a substrate to create a plurality of cavities, the substrate including a metal-containing material. The method includes disposing a resin over the portion, including filling at least some of the plurality of cavities with the resin. The method includes anodizing the substrate, including the portion. The method includes disposing a hydrocarbon lubricant over the anodized substrate.

What is claimed: 
     
         1 . A method comprising:
 etching a portion of a substrate to create a plurality of cavities, the substrate comprising a metal-containing material;   disposing a resin over the portion, including filling at least some of the plurality of cavities with the resin;   anodizing the substrate, including the portion; and   disposing a hydrocarbon lubricant over the anodized substrate.   
     
     
         2 . The method of  claim 1 , wherein disposing the resin comprises insert molding of the resin over the portion. 
     
     
         3 . The method of  claim 1 , wherein the substrate comprises at least one of aluminum, iron, magnesium, copper, titanium, and an alloy of any of the foregoing. 
     
     
         4 . The method of  claim 1 , wherein resin comprises at least one of polybutylene terephthalate (PBT), polyphenylene sulfide (PPS), polyamide (nylon), polyphthalamide (PPA), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), and ABS/PC. 
     
     
         5 . The method of  claim 1 , wherein the resin comprises between about 15 and about 50 wt % of glass fiber. 
     
     
         6 . The method of  claim 1 , wherein the hydrocarbon lubricant comprises at least one of a processing oil, a wax, a mineral oil, a vegetable oil, a hydrogenated polyolefin, an ester, a silicone, a fluorocarbon, and petroleum jelly. 
     
     
         7 . The method of  claim 1 , wherein the hydrocarbon lubricant comprises a petroleum jelly. 
     
     
         8 . A method comprising:
 forming a substrate using computer controlled machining, the substrate comprising a metal-containing material;   etching a portion of the substrate to create a plurality of cavities;   disposing a resin comprising glass fibers over the portion, including filling at least some of the plurality of cavities with the resin;   anodizing the substrate, including the portion; and   disposing a hydrocarbon lubricant over the anodized substrate.   
     
     
         9 . The method of  claim 8 , wherein disposing the resin comprises insert molding at a molding temperature of between about 130° C. and about 150° C. 
     
     
         10 . The method of  claim 8 , wherein the hydrocarbon lubricant disposed over the anodized substrate has a thickness of between about 10 μm and about 20 μm. 
     
     
         11 . The method of  claim 8 , wherein the hydrocarbon lubricant has a viscosity of between about 60,000 cps and about 70,000 cps. 
     
     
         12 . The method of  claim 8 , wherein the hydrocarbon lubricant comprises nano pigments, dyes, or a combination thereof. 
     
     
         13 . The method of  claim 8 , further comprising forming an electronic device comprising the anodized substrate having the hydrocarbon lubricant disposed thereover. 
     
     
         14 . A method comprising:
 forming a substrate using computer controlled machining, the substrate comprising a metal-containing material;   etching a portion of the substrate to create a plurality of cavities;   disposing a resin comprising glass fibers over the portion, including filling at least some of the plurality of cavities with the resin;   processing the substrate, including the portion, using computer controlled machining;   anodizing the substrate, including the portion; and   disposing a hydrocarbon lubricant over the anodized substrate.   
     
     
         15 . The method of  claim 14 , wherein the anodized substrate having the hydrocarbon lubricant disposed thereover has at least one of the following:
 an Rz of less than or equal to about 2 μm; and   an Ra of less than or equal to about 1 μm.