Light module having a heatsink crimped around a printed circuit board, and a method for crimping a heat sink around a printed circuit board

Abstract

A device is provided that includes a printed circuit board having a light emitting diode. The printed circuit board is substantially planar and has a length and a width. The printed circuit board includes two first edges extending substantially the length of the printed circuit board. The device also includes a heatsink extending substantially the width and the length of the printed circuit board. The heatsink includes edges along the length of the printed circuit board, and an edge of the printed circuit board is positioned in a channel on an edge of the heatsink. The channel is crimped. A method for manufacturing a light module according to the present disclosure includes positioning a first edge of a printed circuit board in a channel on a second edge of a heatsink. The method further includes crimping the channel.

1 . A device comprising:
 a printed circuit board having at least one light emitting diode, the printed circuit board being substantially planar and having a length and a width, the printed circuit board including two first edges extending substantially the length of the printed circuit board; and   a heatsink extending substantially the width and the length of the printed circuit board, the heatsink including two second edges along the length of the printed circuit board, at least one of the first edges of the printed circuit board being positioned in at least one channel on at defined by at least one of the second edges of the heatsink, the at least one channel being crimped, wherein the at least one of the second edges of the heatsink has an arm extending over the at least one of the first edges of the printed circuit board, the arm including:
 a first portion extending from a substantially planar base of the heatsink; and 
 a second portion extending from the first portion at an angle toward the printed circuit board and the base of the heat sink. 
   
     
     
         2 . The device of  claim 1 , wherein:
 the at least one channel is two channels;   the two first edges of the printed circuit board are positioned in the two channels; and   the two channels are crimped.   
     
     
         3 . The device of  claim 1 , wherein the crimping mechanically couples the heatsink and the printed circuit board. 
     
     
         4 . The device of  claim 3 , wherein the crimping provides structural stability and heat conduction. 
     
     
         5 . The device of  claim 1 , wherein the heatsink comprises extruded aluminum. 
     
     
         6 . The device of  claim 5 , wherein the crimping comprises mechanically deforming the aluminum heatsink to couple to the printed circuit board. 
     
     
         7 . The device of  claim 1 , wherein the printed circuit board is interposed between the heatsink and a lens, and wherein the printed circuit board, the heatsink, and the lens form, in combination a first light module; the device further comprising:
 at least one second light module; and   two endcaps arranged on opposing ends of the first and second light modules, the two endcaps being mechanically coupled to the first and second light modules and providing a seal to inhibit ingress from the ends of the first and second light modules to the printed circuit board.   
     
     
         8 . The device of  claim 1 , wherein the base spans substantially the width of the printed circuit board and is substantially parallel to the printed circuit board. 
     
     
         9 . A method for manufacturing a light module, comprising:
 positioning at least one of two first edges of a printed circuit board in at least one channel defined in at least one of two second edges of a heatsink, the at least one of the second edges of the heatsink having an arm extending over the at least one of the first edges of the printed circuit board, the printed circuit board having at least one light emitting diode, the printed circuit board being substantially planar and having a length and a width, the two first edges of the printed circuit board extending substantially the length of the printed circuit board, the heatsink extending substantially the width and the length of the printed circuit board, the heatsink including the two second edges along the length of the printed circuit board; and   crimping the arm of the at least one of the second edges of the heatsink to capture the at least one of the first edges of the printed circuit board in the at least one channel, wherein the arm extends over the at least one of the first edges of the printed circuit board prior to and after crimping.   
     
     
         10 . The method of  claim 9 , wherein:
 the at least one channel is two channels;   the positioning operation includes positioning the two first edges of the printed circuit board in the two channels; and   the crimping operation includes crimping the two first edges of the printed circuit board to capture the two first edges of the printed circuit board in the two channels.   
     
     
         11 . The method of  claim 9 , wherein the crimping operation comprises mechanically coupling the heatsink and the printed circuit board. 
     
     
         12 . The method of  claim 9 , wherein the crimping operation provides structural stability and heat conduction. 
     
     
         13 . The method of  claim 9 , wherein:
 the heatsink comprises extruded aluminum; and   the crimping operation comprises mechanically deforming the aluminum heatsink to couple to the printed circuit board.   
     
     
         14 . The method of  claim 9 , further comprising:
 positioning the printed circuit board between the heatsink and a lens, the printed circuit board, the heatsink, and the lens forming in combination a first light module; and   arranging two endcaps on opposing ends of the first light module and at least one second light module, the two endcaps being mechanically coupled to the first and second light modules and providing a second seal to inhibit ingress from the ends of the first and second light modules to the printed circuit board.   
     
     
         15 . The method according to  claim 9 , wherein prior to the crimping operation, the arm of the at least one of the second edges of the heatsink includes:
 a first portion extending from a substantially planar base of the heatsink at an angle toward a central longitudinal axis defined by the heatsink; and   a second portion extending from the first portion at an angle downwardly toward the printed circuit board and the base of the heat sink.   
     
     
         16 . The method according to  claim 15 , wherein the crimping operation closes a gap between an end of the second portion of the arm and the printed circuit board. 
     
     
         17 . The device of  claim 1 , wherein the first portion of the arm extends toward a central longitudinal axis defined by the heatsink, and the second portion of the arm extends from the first portion at the angle downwardly toward the printed circuit board and the base of the heat sink.