US2018309060A1PendingUtilityA1
Method of manufacturing organic light-emitting device and method of manufacturing display unit
Est. expirySep 19, 2033(~7.2 yrs left)· nominal 20-yr term from priority
H01L 51/504H01L 51/5012H01L 51/0005H01L 27/3211H01L 51/56H01L 2251/558H01L 27/3246H01L 2227/323H01L 51/0016H01L 51/0004H01L 51/0019H10K 71/40H10K 71/236H10K 59/35H10K 71/221H10K 71/13H10K 2102/351H10K 59/122H10K 59/1201H10K 50/11H10K 71/135H10K 71/00H10K 50/13H10K 71/166
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Claims
Abstract
There is provided a method of manufacturing an organic light-emitting device including: forming a first organic material layer on a substrate; and forming a mask in a first region on the first organic material layer, and then selectively removing the first organic material layer to form a first organic layer in the first region.
Claims
exact text as granted — not AI-modifiedThe application is claimed as follows:
1 . A method of manufacturing an organic light-emitting device comprising:
forming a first organic light-emitting material layer on a substrate; thereafter selectively forming a first mask in a first region on and in direct contact with a portion of the first organic light-emitting material layer, and then selectively removing the first organic light-emitting material layer which is not in the first region to form a first organic layer, wherein the first mask is formed of a resist material.
2 . The method of manufacturing the organic light-emitting device according to claim 1 , wherein the first organic light-emitting material layer is formed with use of an evaporation method.
3 . The method of manufacturing the organic light-emitting device according to claim 1 , wherein after the first organic layer is formed, the first mask is removed with the use of dry etching.
4 . The method of manufacturing the organic light-emitting device according to claim 1 , wherein the first mask is formed by a reverse offset printing method.
5 . The method of manufacturing the organic light-emitting device according to claim 1 , further comprising forming a second organic layer after the first organic layer is formed.
6 . The method of manufacturing the organic light-emitting device according to claim 5 , wherein
a second organic light-emitting material layer is firstly formed on the first organic layer and the substrate, and then a second mask is selectively formed in a second region on and in direct contact with a portion of the second organic light-emitting material layer, the second region is different from the first region, and thereafter the second organic light-emitting material layer is selectively removed to form the second organic layer in the second region.
7 . The method of manufacturing the organic light-emitting device according to claim 6 , wherein after the first organic layer and the second organic layer are formed, the first mask and the second mask are removed with the use of dry etching.
8 . The method of manufacturing the organic light-emitting device according to claim 6 , wherein the second organic light-emitting material layer is formed with use of an evaporation method.
9 . The method of manufacturing the organic light-emitting device according to claim 6 , further comprising forming a third organic layer after the first and second organic layers are formed.
10 . The method of manufacturing the organic light-emitting device according to claim 9 , wherein
a third organic light-emitting material layer is firstly formed on the first and second organic layers and the substrate, and then a third mask is selectively formed in a third region on and in direct contact with a portion of the third organic light-emitting material layer, the third region is different from the first region and the second region, and thereafter the third organic light-emitting material layer is selectively removed to form the third organic layer in the third region.
11 . The method of manufacturing the organic light-emitting device according to claim 10 , wherein after the first organic layer, the second organic layer and the third organic layer are formed, the first mask, the second mask and the third mask are removed with the use of dry etching.Join the waitlist — get patent alerts
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