Aluminum alloy housing and preparation method thereof

Abstract

This disclosure provides an aluminum alloy housing and a preparation method for same. An external surface of the aluminum alloy housing has a convex portion and a concave portion, the convex portion has a convex oxide film, the concave portion has a concave oxide film, a surface of the convex oxide film has a glossiness of 90-150, and a surface of the concave oxide film has a glossiness of 5-25.

What is claimed is: 
     
         1 . An aluminum alloy housing, comprising an external surface having a convex portion and a concave portion, wherein the convex portion includes a convex oxide film, the concave portion includes a concave oxide film, a surface of the convex oxide film has a glossiness of 90-150, and a surface of the concave oxide film has a glossiness of 5-25. 
     
     
         2 . The aluminwn alloy housing according to  claim 1 , wherein a height difference between the convex portion and the concave portion is 0.05-0.2 mm. 
     
     
         3 . The aluminum alloy housing according to  claim 1 , wherein the convex oxide film and the concave oxide film have different colors. 
     
     
         4 . A preparation method for an aluminum alloy housing, comprising steps of:
 step a: performing first anodic oxidation on a surface of the aluminum alloy housing substrate;   step b: performing mechanical polishing on the surface of the aluminum alloy housing substrate on which the first anodic oxidation has been performed;   step c: performing anti-etching protection on the surface of an aluminum alloy housing substrate on which the mechanical polishing has been performed, so as to form a protective film on the surface of the aluminum alloy housing substrate;   step d: forming, by using an etching method, a pattern layer having a convex-concave pattern on the surface of the aluminum alloy housing substrate on which the protective film is formed;   step e: performing second anodic oxidation on the surface of the aluminum alloy housing substrate having the pattern layer; and   step f: removing the protective film from the surface of the aluminum alloy housing substrate on which the second anodic oxidation has been performed, to perform deprotection.   
     
     
         5 . The preparation method according to  claim 4 , wherein the first anodic oxidation or the second anodic oxidation comprises performing pretreatment on the surface of the aluminum alloy housing substrate and then forming an anode film by the corresponding anodic oxidation. 
     
     
         6 . The preparation method according to  claim 5 , wherein the pretreatment comprises: performing alkali etching for 3-20 s at a temperature of 50-70° C. by using 50-60 g/L of sodium hydroxide, neutralizing for 10-20 s a temperature of 15-25° C. by using 200-300 ml/L of nitric acid, and performing chemical polishing for 5-20 s at a temperature of 90-95° C. by using a chemical polishing solution containing 650-750 ml/L of phosphoric acid and 350-250 ml/L of sulfuric acid. 
     
     
         7 . The preparation method according to  claim 4 , wherein the first or second anodic oxidation comprises oxidizing the surface of the aluminum alloy housing substrate for 15-50 min under an anode voltage of 13-17 V and at a temperature of 10-21° C. by using 190-200 g/L of sulfuric acid. 
     
     
         8 . The preparation method according to  claim 4 , wherein in step c, the anti-etching protection comprises: spraying an anti-etching photo-sensitive ink on the surface of the aluminum alloy housing substrate on which the mechanical polishing has been performed and curing; disposing a film in a region where the pattern needs to be formed, covering the film with a silicone membrane; performing exposure; and washing away an unexposed part of the anti-etching photo-sensitive ink to perform development. 
     
     
         9 . The preparation method according to  claim 8 , wherein a condition of the curing includes drying for 10-20 min at a temperature of 80-85° C. 
     
     
         10 . The preparation method according to  claim 4 , wherein in step d, the etching method includes etching for 1-10 min at a temperature of 40-45° C. by using acid etching solution. 
     
     
         11 . The preparation method according to  claim 4 , wherein the acid etching solution contains 100-150 parts by weight of ferric chloride and 80-120 parts by weight of phosphoric acid, with respect to 100 parts by weight of water.