Strain isolation structures for stretchable electronics

Abstract

Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

1 . An apparatus comprising:
 a device component;   a conductive stretchable interconnect electrically coupled with the device component at a junction region;   a first buffer structure including a first buffer structure main body and a first projection portion extending outwardly from the first buffer structure main body;   a second buffer structure including a second buffer structure main body and a second projection portion extending outwardly from the first buffer structure main body; and   an encapsulant encapsulating the device component, the junction region, the first buffer structure, and the second buffer structure.   
     
     
         2 - 44 . (canceled) 
     
     
         45 . The apparatus of  claim 1 , wherein the first buffer structure has a disk shape. 
     
     
         46 . The apparatus of  claim 1 , wherein the first projection portion has a polygonal shape. 
     
     
         47 . The apparatus of  claim 1 , wherein the first buffer structure is positioned such that at least a portion of the first buffer structure main body overlaps with the device component. 
     
     
         48 . The apparatus of  claim 1 , wherein the first buffer structure is positioned such that at least a portion of the first buffer structure contacts the device component or the conductive stretchable interconnect. 
     
     
         49 . The apparatus of  claim 1 , wherein the first buffer structure is positioned such that at least a portion of the encapsulant extends between the first buffer structure and the device component. 
     
     
         50 . The apparatus of  claim 1 , wherein the first buffer structure main body has a torus shape. 
     
     
         51 . The apparatus of  claim 1 , wherein the second buffer structure is positioned such that at least a portion of the device component or the conductive stretchable interconnect is disposed between the first buffer structure and the second buffer structure. 
     
     
         52 . The apparatus of  claim 1 , wherein a central point of the first buffer structure and a central point of the second buffer structure are generally coincident with each other. 
     
     
         53 . An apparatus comprising:
 a device component;   a conductive stretchable interconnect electrically coupled with the device component at a junction region;   a first buffer structure and a second buffer structure, both the first buffer structure and the second buffer structure having a disk shape; and   an encapsulant encapsulating the device component, the junction region, the first buffer structure, and the second buffer structure.   
     
     
         54 . The apparatus of  claim 54 , wherein the first buffer structure is positioned such that at least a portion of the first buffer structure overlaps with the device component. 
     
     
         55 . The apparatus of  claim 54 , wherein the first buffer structure is positioned such that at least a portion of the first buffer structure contacts the device component or the conductive stretchable interconnect. 
     
     
         56 . The apparatus of  claim 54 , wherein the first buffer structure is positioned such that at least a portion of the encapsulant extends between the first buffer structure and the device component. 
     
     
         57 . The apparatus of  claim 54 , wherein the second buffer structure is positioned such that at least a portion of the device component or the conductive stretchable interconnect is disposed between the first buffer structure and the second buffer structure. 
     
     
         58 . The apparatus of  claim 54 , wherein a central point of the first buffer structure and a central point of the second buffer structure are generally coincident with each other. 
     
     
         59 . The apparatus of  claim 54 , wherein the first buffer structure and the second buffer structure are each positioned on a first side of the device component. 
     
     
         60 . The apparatus of  claim 54 , wherein the first buffer structure has a central axis and an outer edge surface defining an outer diameter of the disk shape. 
     
     
         61 . The apparatus of  claim 61 , wherein the first buffer structure is positioned relative to the device component such that the central axis of the buffer structure is horizontally offset from the junction region in a first direction and the outer edge surface of the first buffer structure is horizontally offset from the junction region in a second opposing direction. 
     
     
         62 . An apparatus comprising:
 a device component;   a conductive stretchable interconnect coupled with the device component at a junction region;   a buffer structure including a main body and a projection portion, the projection portion extending outwardly from the main body and overlapping with at least a portion of the conductive stretchable interconnect; and   an encapsulant encapsulating the device component, the junction region, and the buffer structure.   
     
     
         63 . An apparatus comprising:
 a device component;   a conductive stretchable interconnect electrically coupled with the device component at a junction region;   a buffer structure having a torus shape, the buffer structure overlapping with at least a portion of the conductive stretchable interconnect; and   an encapsulant encapsulating the device component, the junction region, and the buffer structure.