Copper alloy material
Abstract
A copper alloy material has a composition including: 0.1 mass % or more and 1.5 mass % or less of Cr; 0.05 mass % or more and 0.25 mass % or less of Zr; 0.005 mass % or more and 0.10 mass % or less of P; and a Cu balance including inevitable impurities. The copper alloy material includes a Cr—Zr—P compound containing Cr, Zr and P and an area ratio of the Cr—Zr—P compound is in a range of 0.5% or more and 5.0% or less in a structure observation, and the Cr—Zr—P compound is in a form of a needle shape or a granular shape and a length a longest side of the needle shape or the granular shape is 100 μm or less.
Claims
exact text as granted — not AI-modified1 . A copper alloy material having a composition including:
0.1 mass % or more and 1.5 mass % or less of Cr; 0.05 mass % or more and 0.25 mass % or less of Zr; 0.005 mass % or more and 0.10 mass % or less of P; and a Cu balance including inevitable impurities, wherein the copper alloy material includes a Cr—Zr—P compound containing Cr, Zr and P and an area ratio of the Cr—Zr—P compound is in a range of 0.5% or more and 5.0% or less in a structure observation, and the Cr—Zr—P compound is in a form of a needle shape or a granular shape and a length a longest side of the needle shape or the granular shape is 100 μm or less.
2 . The copper alloy material according to claim 1 ,
wherein, after performing a heat treatment at 1000° C. for 30 minutes retention, an average size of crystal grains is 200 μm or less.
3 . The copper alloy material according to claim 1 ,
wherein, the composition of the copper alloy material further includes Co in a range of 0.02 mass % or more and 0.15 mass % or less, and an atomic ratio of Co to P, [Co]/[P], is in a range of 0.5≤[Co]/[P]≤5.0.
4 . The copper alloy material according to claim 3 , wherein a total content of Ti and Hf in the inevitable impurities is 0.10 mass % or less.Join the waitlist — get patent alerts
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