Substrate treatment apparatus

Abstract

A substrate treatment apparatus includes: a substrate holding unit; a rotator for rotating the substrate holding unit; a first liquid nozzle for supplying a rinsing liquid; a second liquid nozzle for supplying a low surface tension liquid; a heater ; a lifting mechanism for relatively moving up and down the heater between a contact position allowing the heater to be brought into contact with the lower surface of the substrate and a separation position allowing the heater to be separated from the substrate; a gas nozzle provided in an upper surface of the heater to suck the substrate; a suction pump for sucking an atmosphere above the heater through the gas nozzle; a gas supply source for supplying an inert gas toward above the heater through the gas nozzle; and a controller for selectively performing suction of the atmosphere or supply of the inert gas, through the gas nozzle.

What is claimed is: 
     
         1 . A substrate treatment apparatus comprising:
 a substrate holding unit provided with a chuck member that holds a circumference of a substrate;   a rotator for rotating the substrate holding unit around a rotating axis;   a first liquid nozzle for supplying a rinsing liquid to an upper surface of the substrate held by said chuck member;   a second liquid nozzle for supplying a low surface tension liquid to replace said rinsing liquid to the upper surface of said substrate;   a heater for heating said substrate from a lower surface of said substrate;   a lifting mechanism for relatively moving up and down said heater between a contact position allowing said heater to be brought into contact with the lower surface of said substrate and a separation position allowing said heater to be separated from the lower surface of said substrate;   a gas nozzle provided in an upper surface of said heater to suck said substrate;   a suction pump for sucking an atmosphere above said heater through said gas nozzle;   a gas supply source for supplying an inert gas toward above said heater through said gas nozzle; and   a controller for selectively performing said suction of the atmosphere or the supply of said inert gas, through said gas nozzle.   
     
     
         2 . The substrate treatment apparatus according to  claim 1 , wherein
 said heater is provided with a push-up pin unit for pushing up said substrate sucked onto the upper surface of said heater.