Display device and manufacturing method thereof

Abstract

A display device is provided. The display device includes a display panel, a flexible circuit board, an integrated circuit, and a conductive layer. The flexible circuit board is electrically connected with the display panel and includes a plurality of conductive wires. The integrated circuit is disposed on the flexible circuit board and has a plurality of bumps. The conductive layer is disposed between the integrated circuit and the flexible circuit board and covers a periphery of the integrated circuit. In addition, the conductive layer includes an adhesive and a plurality of conductive particles distributed in the adhesive. Moreover, the bumps are electrically connected with the conductive wires through the conductive particles.

What is claimed is: 
     
         1 . A display device, comprising:
 a display panel;   a flexible circuit board, electrically connected with the display panel, and the flexible circuit board comprising a plurality of conductive wires;   an integrated circuit, disposed on the flexible circuit board, and the integrated circuit having a plurality of bumps; and   a conductive layer, disposed between the integrated circuit and the flexible circuit board, and the conductive layer comprising an adhesive and a plurality of conductive particles distributed in the adhesive, wherein the bumps are electrically connected with the conductive wires through the conductive particles.   
     
     
         2 . The display device as claimed in  claim 1 , wherein a thickness of at least one of the conductive wires is less than or equal to 3 μm. 
     
     
         3 . The display device as claimed in  claim 1 , wherein the flexible circuit board comprises a display panel bonding area, an integrated circuit bonding area, and a wiring area, and the wiring area is located at a side of the display panel bonding area and surrounds the integrated circuit bonding area. 
     
     
         4 . The display device as claimed in  claim 3 , wherein the conductive wires extend from the integrated circuit bonding area to the display panel bonding area through the wiring area. 
     
     
         5 . The display device as claimed in  claim 3 , wherein at least one of the conductive wires comprises an integrated circuit pad and an extending portion connected with the integrated circuit pad, the integrated circuit pad is located in the integrated circuit bonding area, and a width of the integrated circuit pad is greater than a width of the extending portion, wherein the width of the integrated circuit pad is in a range from 3 μm to 20 μm, and the width of the extending portion is in a range from 1 μm to 7 μm. 
     
     
         6 . The display device as claimed in  claim 1 , wherein a conductive path between at least one of the bumps and the integrated circuit pad is discontinuous. 
     
     
         7 . The display device as claimed in  claim 3 , wherein the flexible circuit board further comprises a plurality of spacers, the spacers and the conductive wires are disposed alternately, and a thickness of at least one of the spacers is greater than a thickness of at least one of the conductive wires adjacent to the at least one of the spacers. 
     
     
         8 . The display device as claimed in  claim 7 , wherein a thickness difference ΔH 1  between the at least one of the spacers in the display panel bonding area and at least one of the conductive wires adjacent to the at least one of the spacers satisfies a formula as follows: ΔH 1 =R(1-X %), wherein R is a diameter of one of the conductive particles, X % is a particle size compression rate of one of the conductive particles, and X % is in a range from 30% to 70%. 
     
     
         9 . The display device as claimed in  claim 7 , wherein a thickness difference ΔH 2  between the at least one of the spacers in the integrated circuit bonding area and at least one of the conductive wires adjacent to the at least one of the spacers satisfies a relation as follows: 1/4 h≤ΔH 2 ≤1/2 h, wherein h is a thickness of one of the bumps. 
     
     
         10 . The display device as claimed in  claim 3 , wherein the flexible circuit board further comprises an insulating layer disposed in the wiring area, and the insulating layer covers the conductive wires. 
     
     
         11 . A display device, comprising:
 a display panel;   a flexible circuit board, electrically connected with the display panel and comprising a plurality of conductive wires, wherein a thickness of at least one of the conductive wires is less than or equal to 3 μm, at least one of the conductive wires comprises an extending portion, and a width of the extending portion is in a range from 1 μm to 7 μm; and   an integrated circuit, disposed on the flexible circuit board, wherein the integrated circuit has a plurality of bumps electrically connected with the conductive wires.   
     
     
         12 . The display device as claimed in  claim 11 , further comprising a conductive layer disposed between the integrated circuit and the flexible circuit board, and the conductive layer comprising an adhesive and a plurality of conductive particles distributed in the adhesive, wherein the bumps are electrically connected with the conductive wires through the conductive particles. 
     
     
         13 . A manufacturing method of a display device, comprising:
 providing a flexible circuit board comprising a plurality of conductive wires, the conductive wires manufactured by performing a thin-film photolithography process, wherein a thickness of at least one of the conductive wires is less than or equal to 3 μm, the at least one of the conductive wires comprises an extending portion, and a width of the extending portion is in a range from 1 μm to 7 μm;   electrically connecting the flexible circuit board and an integrated circuit; and   electrically connecting the flexible circuit board and a display panel.   
     
     
         14 . The manufacturing method of the display device as claimed in  claim 13 , wherein the flexible circuit board further comprises a plurality of spacers, the spacers and the conductive wires are disposed alternately, and the spacers are manufactured by performing a thin-film photolithography process. 
     
     
         15 . The manufacturing method of the display device as claimed in  claim 13 , wherein the flexible circuit board comprises a display panel bonding area, an integrated circuit bonding area, and a wiring area, and the wiring area is located at a side of the display panel bonding area, and the wiring area surrounds the integrated circuit bonding area. 
     
     
         16 . The manufacturing method of the display device as claimed in  claim 15 , wherein the at least one of the conductive wires extends from the integrated circuit bonding area to the display panel bonding area through the wiring area. 
     
     
         17 . The manufacturing method of the display device as claimed in  claim 15 , wherein the step of electrically connecting the flexible circuit board and the integrated circuit comprises:
 forming a conductive layer on at least one of the conductive wires in the integrated circuit bonding area;   performing a pre-bonding process to pre-align the flexible circuit board and the integrated circuit; and   performing a thermal compression bonding process to fix the conductive layer between the flexible circuit board and the integrated circuit.   
     
     
         18 . The manufacturing method of the display device as claimed in  claim 15 , wherein the at least one of the conductive wires further comprises an integrated circuit pad connected with the extending portion, the integrated circuit pad is located in the integrated circuit bonding area, and a width of the integrated circuit pad is greater than a width of the extending portion, wherein the width of the integrated circuit pad is in a range from 3 μm to 20 μm. 
     
     
         19 . The manufacturing method of the display device as claimed in  claim 15 , wherein the flexible circuit board further comprises an insulating layer disposed in the wiring area, and the insulating layer covers the conductive wires. 
     
     
         20 . The manufacturing method of the display device as claimed in  claim 14 , wherein a thickness of at least one of the spacers is greater than a thickness of the at least one of the conductive wires adjacent to the at least one of the spacers.