Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil

Abstract

A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.

1 . A multilayer printed wiring board comprising
 one or more insulating layers and at least one conductive layer which are stacked alternately,   the one or more insulating layers including at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer, and   a percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers being within a range of 5 to 90%.   
     
     
         2 . The multilayer printed wiring board of  claim 1 , wherein:
 each of the at least one polyolefin resin layer contains a component (A) representing polyolefin-based elastomer and a component (B) representing thermosetting resin; and   a percentage by weight of the component (A) representing polyolefin-based elastomer relative to the at least one polyolefin resin layer is within a range of 50 to 95%.   
     
     
         3 . The multilayer printed wiring board of  claim 2 , wherein
 the component (A) representing polyolefin-based elastomer contains one or more kinds of compounds selected from a group consisting of: polystyrene-poly(ethylene/propylene)block-polystyrene copolymer; polystyrene-poly(ethylene-ethylene/propylene)block-polystyrene copolymer, polystyrene-poly(ethylene/butylene)block-polystyrene copolymer; polystyrene-polyisoprene block copolymer; hydrogenated polystyrene-polyisoprene-polybutadiene block copolymer; polystyrene-poly(butadienebutylene)block-polystyrene copolymer, ethylene-glycidyl methacrylate copolymer, ethylene-glycidyl methacrylate-acrylic acid methyl copolymer, and ethylene-glycidyl methacrylate-vinyl acetate copolymer.   
     
     
         4 . The multilayer printed wiring board of  claim 2 , wherein
 the component (B) representing thermosetting resin contains one or more kinds of compounds selected from a group consisting of epoxy resin, phenol resin, bismaleimide resin, and polyphenylene ether oligomer having vinyl groups at both ends.   
     
     
         5 . The multilayer printed wiring board of  claim 1 , wherein
 each of the at least one polyolefin resin layer further contains a component (C) representing curing accelerator.   
     
     
         6 . The multilayer printed wiring board of  claim 1 , wherein
 each of the at least one polyolefin resin layer further contains a component (D) representing filler.   
     
     
         7 . The multilayer printed wiring board of  claim 1 , wherein
 each of the at least one polyolefin resin layer has a storage modulus within a range of 10 5  to 10 8  Pa at a temperature ranging from 25 to 150° C. after treated at 180° C. for 60 minutes.   
     
     
         8 . A multilayer metal-clad laminated board comprising:
 one or more insulating layers and at least one conductive layer which are stacked alternately; and   at least one metal layer serving as at least one of opposite outermost layers of the multilayer metal-clad laminated board,   the one or more insulating layers including at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer,   a percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers being within a range of 5 to 90%,   each of the at least one polyolefin resin layer containing a component (A) representing polyolefin-based elastomer and a component (B) representing thermosetting resin, and   a percentage by weight of the component (A) representing polyolefin-based elastomer relative to the at least one polyolefin resin layer being within a range of 50 to 95%.   
     
     
         9 . A resin-coated metal foil comprising:
 a metal foil; and   a stack on the metal foil, the stack including a first insulating layer and a second insulating layer which are arranged in this order from the metal foil,   the first insulating layer being: an insulating layer including not at least one polyolefin resin layer but at least one liquid crystal polymer resin layer; or an insulating layer including the at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer,   the second insulating layer including at least one semi-cured polyolefin resin layer,   a percentage of volume of the at least one liquid crystal polymer resin layer relative to total volume of the first insulating layer and the second insulating layer being within a range of 5 to 90%,   each of the at least one polyolefin resin layer and the at least one semi-cured polyolefin resin layer containing a component (A) representing polyolefin-based elastomer and a component (B) representing thermosetting resin, and   
       a percentage of weight of the component (A) representing polyolefin-based elastomer relative to total weight of the at least one polyolefin resin layer and the at least one semi-cured polyolefin resin layer being within a range of 50 to 95%.