Pvd tool to deposit highly reactive materials

Abstract

A deposition tool includes a vacuum chamber and a physical vapor deposition module including a target source in the vacuum chamber. The target source includes a target material for depositing on a workpiece. An evaporator module is independent of the physical vapor deposition module and is mounted within an enclosure in the vacuum chamber. A gate is configured to selectively open the enclosure to permit evaporation of a coating element to coat the target source in the physical vapor deposition module.

1 . A deposition tool, comprising:
 a vacuum chamber;   a physical vapor deposition module including a target source within the vacuum chamber, the target source including a target material for depositing on a workpiece;   an evaporator module independent of the physical vapor deposition module and mounted within an enclosure within the vacuum chamber; and   a gate configured to selectively open the enclosure to permit evaporation of a coating element to coat the target source in the physical vapor deposition module.   
     
     
         2 . The deposition tool as recited in  claim 1 , wherein physical vapor deposition module includes a sputtering tool. 
     
     
         3 . The deposition tool as recited in  claim 1 , wherein the target source includes a material subject to damage when exposed to air. 
     
     
         4 . The deposition tool as recited in  claim 1 , wherein the target source includes a material selected from the group consisting of MgO and La. 
     
     
         5 . The deposition tool as recited in  claim 1 , wherein the coating element includes a material selected from the group consisting of Ti, Al, Si and Cr. 
     
     
         6 . The deposition tool as recited in  claim 1 , wherein the coating element includes a compound material. 
     
     
         7 . The deposition tool as recited in  claim 1 , wherein the gate includes a gate valve configured to open the evaporator module. 
     
     
         8 . A deposition tool, comprising:
 a vacuum chamber;   a physical vapor deposition module including a target source within the vacuum chamber, the target source including a target material subject to damage when exposed to air, the target material for deposition of a thin film on a workpiece;   an enclosure integrally formed within the vacuum chamber, the enclosure including a gate configured to selectively open the enclosure, the gate forming an opening opposing a position of the target source in the vacuum chamber; and   an evaporator module independent of the physical vapor deposition module and mounted within the enclosure in the vacuum chamber such that evaporation of a coating element through the gate coats the target source in the physical vapor deposition module.   
     
     
         9 . The deposition tool as recited in  claim 8 , wherein physical vapor deposition module includes a sputtering tool. 
     
     
         10 . The deposition tool as recited in  claim 8 , wherein the target source includes a material selected from the group consisting of MgO and La. 
     
     
         11 . The deposition tool as recited in  claim 8 , wherein the coating element includes a material selected from the group consisting of Ti, Al, Si and Cr. 
     
     
         12 . The deposition tool as recited in  claim 8 , wherein the coating element includes a compound material. 
     
     
         13 . The deposition tool as recited in  claim 8 , wherein the gate includes a manual gate valve. 
     
     
         14 .- 20 . (canceled)