Substrate treatment apparatus and substrate treatment method

Abstract

According to an embodiment, a substrate treatment apparatus includes a noble metal-containing member having a concave-convex surface including a noble metal, and a liquid chemical supply member to supply a liquid chemical. While convex portions of the concave-convex surface are contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal to remove the metal with etching.

1 . A substrate treatment apparatus comprising:
 a noble metal-containing member having a concave-convex surface including a noble metal; and   a liquid chemical supply member to supply a liquid chemical, wherein   while convex portions of the concave-convex surface are contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, and the metal is removed with etching.   
     
     
         2 . The substrate treatment apparatus according to  claim 1 , wherein
 the concave-convex surface including the noble metal is a concave-convex surface having a porous material on its surface.   
     
     
         3 . The substrate treatment apparatus comprising:
 a noble metal-containing member having a porous material including noble metal on its surface; and   a liquid chemical supply member to supply a liquid chemical, wherein   while the porous material is contact with a predetermined surface of a metal, the liquid chemical is supplied onto the surface of the metal, the metal is removed with etching.   
     
     
         4 . The substrate treatment apparatus according to  claim 1 , wherein
 the predetermined surface of the metal is formed on a surface of a plurality of convex portions of a pattern provided on a substrate.   
     
     
         5 . The substrate treatment apparatus according to  claim 1 , further comprising:
 a first retention member to elevatably retain the noble metal-containing member; and   a second retention member to rotably retain the predetermined surface of the metal.   
     
     
         6 . The substrate treatment apparatus according to  claim 1 , wherein
 the noble metal includes at least any of platinum (Pt), gold (Au), silver (Ag) and palladium (Pd).   
     
     
         7 . The substrate treatment apparatus according to  claim 1 , wherein
 the liquid chemical supply member is a tank to store the liquid chemical, the device further comprising:   a first retention member to retain the noble metal-containing member conveyably to the tank; and   a second retention member to retain a substrate conveyably to the tank.   
     
     
         8 . The substrate treatment apparatus according to  claim 1 , wherein
 a shape of the noble metal-containing member is a shape of a belt that retains a plurality of substrates, the device further comprising   a drive mechanism to move the noble metal-containing member in one direction below the liquid chemical supply member.   
     
     
         9 . The substrate treatment apparatus according to  claim 1 , further comprising:
 a first retention member to rotably retain the noble metal-containing member; and   a second retention member to retain a plurality of substrates on the noble metal-containing member rotably in the same direction and synchronously to the noble metal-containing member.   
     
     
         10 . A substrate treatment method comprising:
 forming a metal film on a pattern of a substrate; and   removing the metal film with etching, by supplying a liquid chemical to the metal film in a state that a noble metal is contact with the metal film.   
     
     
         11 . The substrate treatment method according to  claim 10 , wherein
 a surface of the pattern is exposed by removing the metal film with etching.   
     
     
         12 . The substrate treatment method according to  claim 10 , wherein
 the liquid chemical is alkaline.   
     
     
         13 . The substrate treatment method according to  claim 10 , wherein
 the metal film includes tungsten.   
     
     
         14 . The substrate treatment method according to  claim 10 , wherein
 the noble metal has a concave-convex surface, and the liquid chemical is supplied to the metal film in a state that the concave-convex surface is contact with the metal film.   
     
     
         15 . The substrate treatment method according to  claim 10 , wherein
 the noble metal is porous, and the liquid chemical is supplied to the metal film in a state that the porous noble metal is contact with the metal film.   
     
     
         16 . The substrate treatment method according to  claim 10 , wherein
 the pattern includes a stacked body having conductor films including the same metal as that of the metal film and insulator films alternately stacked.