Package structure and method of manufacturing the same

Abstract

A method of manufacturing a package structure is provided, including forming a first wiring layer on a carrier board, forming a plurality of first conductors on the first wiring layer, forming a first insulating layer that encapsulates the first wiring layer and the first conductors, forming a second wiring layer on the first insulating layer, forming a plurality of second conductors on the second wiring layer, forming a second insulating layer that encapsulates the second wiring layer and the second conductors, and forming at least an opening on the second insulating layer for at least one electronic component to be disposed therein. Since the first and second insulating layers are formed before the opening, there is no need of stacking or laminating a substrate that already has an opening, and the electronic component will not be laminated and make a displacement. Therefore, the package structure thus manufactured has a high yield rate. The present invention further provides the package structure.

1 .- 13 . (canceled) 
     
     
         14 . A method of manufacturing a package structure, comprising:
 forming a first wiring layer on a carrier board;   forming a plurality of first conductors on the first wiring layer;   forming on the carrier board a first insulating layer that has a first surface and a second surface opposing the first surface, encapsulates the first wiring layer and the first conductors, and is coupled to the carrier board via the first surface of the first insulating layer;   forming on the second surface of the first insulating layer a second wiring layer that is electrically connected with the first wiring layer via the first conductors;   disposing a plurality of second conductors on the second wiring layer;   forming on the second surface of the first insulating a second insulating layer that encapsulates the second wiring layer and the second conductors;   forming at least one opening on the second insulating layer, for a portion of a surface of the second wiring layer to be exposed therefrom; and   disposing in the opening at least one electronic component that is electrically connected with the second wiring layer.   
     
     
         15 . The method of  claim 14 , wherein the first wiring layer has a surface flush with the first surface of the first insulating layer. 
     
     
         16 . The method of  claim 14 , wherein the first conductors are conductive pillars. 
     
     
         17 . The method of  claim 14 , wherein the second conductors are conductive pillars. 
     
     
         18 . The method of  claim 14 , wherein the surface of the second wiring layer is higher than or flush with a bottom surface of the opening. 
     
     
         19 . The method of  claim 14 , wherein the surface of the second wiring layer is lower than or flush with a bottom surface of the opening. 
     
     
         20 . The method of  claim 14 , wherein the second wiring layer comprises a plurality of electrical contact pads and a plurality of conductive traces, and the electrical contact pads are coupled to and electrically connected with the electronic component. 
     
     
         21 . The method of  claim 20 , wherein the electrical contact pads are connected with the first conductors. 
     
     
         22 . The method of  claim 20 , wherein the electrical contact pads are not connected with the first conductors, and the conductive traces are connected with the first conductors. 
     
     
         23 . The method of  claim 14 , wherein the opening is formed by a grinding process or a laser process. 
     
     
         24 . The method of  claim 14 , wherein the opening has a step-like structure therein. 
     
     
         25 . The method of  claim 14 , wherein the electronic component is an active component, a passive component, or a combination thereof. 
     
     
         26 . The method of  claim 14 , further comprising disposing on the second insulating layer a plurality of conductive elements that are electrically connected with the second conductors. 
     
     
         27 . The method of  claim 14 , further comprising removing the carrier board after the opening is formed. 
     
     
         28 . The method of  claim 27 , further comprising, after the carrier board is removed, disposing another electronic component on the first surface of the first insulating layer and electrically connecting the another electronic component to the first wiring layer.