Thermal interface structure resilient to shearing forces

Abstract

Providing a thermal interface structure can include: forming a thermal interface material for thermally coupling a heat-generating structure to a heat-dissipating structure such that the thermal interface material capable of enduring a repeated shearing force caused by sliding the heat-generating structure against the heat-dissipating structure; and forming an adhesive material for holding the thermal interface material in place on the heat-dissipating structure.

What is claimed is: 
     
         1 . A thermal interface structure, comprising:
 a thermal interface material for thermally coupling a heat-generating structure to a heat-dissipating structure, the thermal interface material capable of enduring a repeated shearing force caused by sliding the heat-generating structure against the heat-dissipating structure; and   an adhesive material for holding the thermal interface material in place on the heat-dissipating structure.   
     
     
         2 . The thermal interface structure of  claim 1 , wherein the thermal interface material is positioned on a beveled lead-in of the heat-dissipating structure. 
     
     
         3 . The thermal interface structure of  claim 1 , wherein the thermal interface material comprises a foam-like synthetic graphite. 
     
     
         4 . The thermal interface structure of  claim 1 , wherein the thermal interface material has compression ratio of substantially between 30 and 80 percent. 
     
     
         5 . The thermal interface structure of  claim 1 , wherein the thermal interface material is selected to provide a substantially low thermal resistance by substantially filling an air gap between the heat-generating structure and the heat-dissipating structure. 
     
     
         6 . The thermal interface structure of  claim 1 , wherein the adhesive material comprises a pressure-sensitive adhesive. 
     
     
         7 . The thermal interface structure of  claim 1 , wherein the adhesive material comprises a hot-melt adhesive. 
     
     
         8 . The thermal interface structure of  claim 1 , wherein the adhesive material is selected to provide a balance between a thermal performance and a mechanical bonding performance of the thermal interface structure. 
     
     
         9 . The thermal interface structure of  claim 1 , wherein the adhesive material substantially covers an entire surface of the thermal interface material. 
     
     
         10 . The thermal interface structure of  claim 1 , wherein the adhesive material substantially covers only a portion of the thermal interface material corresponding to a contact area between the heat-generating structure and the heat-dissipating structure. 
     
     
         11 . The thermal interface structure of  claim 1 , further comprising a plastic film for protecting the thermal interface material from the repeated shearing force. 
     
     
         12 . The thermal interface structure of  claim 11 , wherein the plastic film covers only portions of the thermal interface material substantially outside of a contact area between the heat-generating structure and the heat-dissipating structure. 
     
     
         13 . A method for providing a thermal interface structure, comprising:
 forming a thermal interface material for thermally coupling a heat-generating structure to a heat-dissipating structure such that the thermal interface material capable of enduring a repeated shearing force caused by sliding the heat-generating structure against the heat-dissipating structure; and   forming an adhesive material for holding the thermal interface material in place on the heat-dissipating structure.   
     
     
         14 . The method of  claim 13 , wherein forming a thermal interface material comprises forming a thermal interface material on a beveled lead-in of the heat-dissipating structure. 
     
     
         15 . The method of  claim 13 , wherein forming a thermal interface material comprises forming a foam-like synthetic graphite. 
     
     
         16 . The method of  claim 13 , wherein forming a thermal interface material comprises forming a thermal interface material having a compression ratio of substantially between 30 and 80 percent. 
     
     
         17 . The method of  claim 13 , wherein forming a thermal interface material comprises forming a thermal interface material to provide a substantially low thermal resistance by substantially filling an air gap between the heat-generating structure and the heat-dissipating structure. 
     
     
         18 . The method of  claim 13 , wherein forming an adhesive material comprises forming a pressure-sensitive adhesive. 
     
     
         19 . The method of  claim 13 , wherein forming an adhesive material comprises forming a hot-melt adhesive. 
     
     
         20 . The method of  claim 13 , wherein forming an adhesive material comprises forming an adhesive material selected to provide a balance between a thermal performance and a mechanical bonding performance of the thermal interface structure. 
     
     
         21 . The method of  claim 13 , wherein forming an adhesive material comprises forming an adhesive material substantially covering an entire surface of the thermal interface material. 
     
     
         22 . The method of  claim 13 , wherein forming an adhesive material comprises forming an adhesive material substantially covering only a portion of the thermal interface material corresponding to a contact area between the heat-generating structure and the heat-dissipating structure. 
     
     
         23 . The method of  claim 13 , further comprising forming a plastic film for protecting the thermal interface material from the repeated shearing force. 
     
     
         24 . The method of  claim 23 , wherein forming a plastic film comprises forming a plastic film covering only portions of the thermal interface material substantially outside of a contact area between the heat-generating structure and the heat-dissipating structure.