Substrate processing device and substrate processing method for carrying out chemical treatment for substrate

Abstract

It is an object to carry out a chemical treatment for a peripheral edge part of a substrate while suppressing an amount of consumption of a processing liquid and a time required for processing. In order to achieve the object, a substrate processing device injects heating steam to a peripheral edge part of a substrate to heat the peripheral edge part when carrying out a chemical treatment for the peripheral edge part of the substrate while rotating the substrate in a substantially horizontal posture. Moreover, the substrate processing device injects a gas from above the substrate toward a predetermined injection target region defined within a range surrounded by a rotating track of the peripheral edge part of the substrate in an upper surface of the substrate, thereby generating, on the substrate, a gas flow which flows from the injection target region toward the peripheral edge part of the substrate.

What is claimed is: 
     
         1 . A substrate processing device for carrying out a chemical treatment for a substrate by using a processing liquid having a reaction rate increased with a rise in temperature, the device comprising:
 a substrate holding portion for holding a substrate in a substantially horizontal posture;   a rotating portion for rotating said substrate held in said substrate holding portion in a substantially horizontal plane;   a plurality of heating portions disposed to be opposed to a plurality of different positions in a rotating track of a peripheral edge part of said substrate respectively and heating said peripheral edge part in said plurality of positions respectively; and   a peripheral edge processing portion for supplying the processing liquid from above to said peripheral edge part heated by said plurality of heating portions, thereby carrying out a chemical treatment for said peripheral edge part.   
     
     
         2 . The substrate processing device according to  claim 1 , wherein said plurality of heating portions include at least one of:
 (1) a thermal fluid supplying portion for supplying a heated fluid to said peripheral edge part of said substrate; and   (2) a light irradiating portion for irradiating said peripheral edge part of said substrate with light,   said peripheral edge part of said substrate is spatially exposed to a part of said heated fluid and said light, and   said heated fluid is made of a material having no chemical reactivity to a substance which is present in said peripheral edge part of said substrate.   
     
     
         3 . The substrate processing device according to  claim 2 , wherein
 each of said plurality of heating portions injects heating steam as said heated fluid to said plurality of positions to heat said peripheral edge part respectively.   
     
     
         4 . The substrate processing device according to  claim 3 , wherein said steam is superheated steam. 
     
     
         5 . The substrate processing device according to  claim 3 , wherein said plurality of heating portions inject said steam to said peripheral edge part along an injection path in an obliquely downward direction from an inside of said substrate toward an outside thereof, respectively. 
     
     
         6 . The substrate processing device according to  claim 3 , further comprising
 a gas injecting portion for injecting a gas from above said substrate toward a predetermined injection target region defined within a range surrounded by a rotating track of said peripheral edge part of said substrate in an upper surface of said substrate, to generate, on the substrate, a gas flow which flows from said injection target region toward said peripheral edge part of said substrate.   
     
     
         7 . The substrate processing device according to  claim 1 ,
 wherein each of said plurality of heating portions supplies a heated fluid so that said heated fluid is applied to a target region defined at an opposing position out of said plurality of different portions,   wherein said heated fluid is made of a material having no chemical reactivity to a substance that is present in said peripheral edge part of said substrate,   wherein a part of said target region overlaps said rotating track of said peripheral edge part, and   wherein a remaining part of said target region protrudes from said substrate.   
     
     
         8 . The substrate processing device according to  claim 7 , wherein each of said plurality of heating portions supplies a heating steam as said heated fluid to heat said peripheral edge part. 
     
     
         9 . The substrate processing device according to  claim 1 , further comprising
 a plurality of gas injecting portion provided respectively corresponding to said plurality of heating portions,   a plurality of holding portions each integrally holding a heating portion out of said plurality of heating portions and a gas injecting portion out of said plurality of gas injecting portions with a position-adjustable manner, said gas injecting portion corresponding to said heating portion,   wherein each of said plurality of gas injecting portion injects a gas from above opposing injection target region out of plurality of injection target regions defined within said peripheral edge part side of a range surrounded by said rotating track of said peripheral edge part of said substrate in an upper surface of said substrate so that said gas is applied to said opposing injection target region to generate, on the substrate, a gas flow which flows from said opposing injection target region toward said peripheral edge part of said substrate , and   wherein said opposing injection target region being positioned closer to a center of said substrate than said target region with regard to said heating portion and said gas injecting portion.   
     
     
         10 . The substrate processing device according to  claim 9 , wherein each of said plurality of gas injecting portion injects said gas along an injection path in an obliquely downward direction from an inside of said substrate toward an outside thereof 
     
     
         11 . A substrate processing method for carrying out a chemical treatment for a substrate by using a processing liquid having a chemical activity varied depending on a temperature, the method comprising:
 a rotating step of holding a substrate in a substantially horizontal posture to rotate the substrate in a substantially horizontal plane;   a heating step of injecting heating steam to a peripheral edge part of said substrate to heat the peripheral edge part in parallel with said rotating step;   a peripheral edge processing step of supplying a processing liquid from above to said peripheral edge part which is heated in said heating step, thereby carrying out a chemical treatment for said peripheral edge part; and   a gas injecting step of injecting a gas from above said substrate toward a predetermined injection target region defined within a range surrounded by a rotating track of said peripheral edge part of said substrate in an upper surface of said substrate, to generate, on the substrate, a gas flow which flows from said injection target region toward said peripheral edge part of said substrate in parallel with said heating step and said peripheral edge processing step.