US2018254149A1PendingUtilityA1

Electronic component having multilayer structure and method of manufacturing the same

62
Assignee: SAMSUNG ELECTRO MECHPriority: Oct 8, 2014Filed: May 3, 2018Published: Sep 6, 2018
Est. expiryOct 8, 2034(~8.2 yrs left)· nominal 20-yr term from priority
Inventors:Sung Hun ChoChang-Ho LeeWon Sik Chong
H01G 4/30H01G 4/012H01G 4/1227H01G 4/385H01G 4/2325H01G 4/12
62
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . An electronic component comprising:
 a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and   an external electrode made of a conductive resin for connecting each ceramic body,   wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitors, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and   wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a float structure multi-layered ceramic capacitor.   
     
     
         2 . The electronic component according to  claim 1 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 
     
     
         3 . The electronic component according to  claim 2 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 
     
     
         4 . The electronic component according to  claim 1 , further comprises:
 an adhesive for adhering between the multi-layered ceramic capacitors.   
     
     
         5 . The electronic component according to  claim 1 , further comprises:
 a metal layer plated on a surface of the external electrode.   
     
     
         6 . An electronic component comprising:
 a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and   an external electrode made of a conductive resin for connecting each ceramic body,   wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitor, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and   wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a T-HMC-open structure multi-layered ceramic capacitor.   
     
     
         7 . The electronic component according to  claim 6 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 
     
     
         8 . The electronic component according to  claim 7 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 
     
     
         9 . The electronic component according to  claim 6 , further comprises:
 an adhesive for adhering between the multi-layered ceramic capacitors.   
     
     
         10 . The electronic component according to  claim 6 , further comprises:
 a metal layer plated on a surface of the external electrode.   
     
     
         11 . An electronic component comprising:
 a laminate formed by stacking a plurality of different types of multi-layered ceramic capacitors; and   an external electrode made of a conductive resin for connecting each ceramic body,   wherein the multi-layered ceramic capacitors is selected from a group consisting of a normal structure multi-layered ceramic capacitor, an open structure multi-layered ceramic capacitor, a thick & horizontally mounted capacitor (T-HMC) structure multi-layered ceramic capacitor, a float structure multi-layered ceramic capacitor, a T-HMC-open structure multi-layered ceramic capacitor, and a T-HMC-Float structure multi-layered ceramic capacitor, and   wherein the multi-layered ceramic capacitor arranged at a most bottom of the laminate is a T-HMC-Float structure multi-layered ceramic capacitor.   
     
     
         12 . The electronic component according to  claim 11 , wherein the remaining multi-layered ceramic capacitor except a lowermost multi-layered ceramic capacitor is the normal structure multi-layered ceramic capacitor. 
     
     
         13 . The electronic component according to  claim 12 , wherein the normal structure multi-layered ceramic capacitor is formed of at least two. 
     
     
         14 . The electronic component according to  claim 11 , further comprises:
 an adhesive for adhering between the multi-layered ceramic capacitors.   
     
     
         15 . The electronic component according to  claim 11 , further comprises:
 a metal layer plated on a surface of the external electrode.

Join the waitlist — get patent alerts

Track US2018254149A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.