Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate

Abstract

The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains satisfy either or both of the following conditions (a) and (b). (a) Producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %. (b) Producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and also producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %.

1 - 24 . (canceled) 
     
     
         25 . A slurry comprising abrasive grains and water,
 the abrasive grains including a tetravalent metal element hydroxide, and producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, wherein   a content of the abrasive grains is 0.01-15 mass % based on the total mass of the slurry.   
     
     
         26 . A slurry comprising abrasive grains and water,
 the abrasive grains including a tetravalent metal element hydroxide, and producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, wherein   a content of the abrasive grains is 0.01-15 mass % based on the total mass of the slurry.   
     
     
         27 . The slurry according to  claim 25 , wherein the abrasive grains produce absorbance of not greater than 0.010 for light with a wavelength of 450-600 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %. 
     
     
         28 . The slurry according to  claim 26 , wherein the abrasive grains produce absorbance of not greater than 0.010 for light with a wavelength of 450-600 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %. 
     
     
         29 . A polishing liquid set comprising constituent components of a polishing liquid separately stored as a first liquid and a second liquid, so that the first liquid and second liquid are mixed to form the polishing liquid,
 wherein the first liquid is the slurry according to  claim 25 , and the second liquid comprises an additive and water.   
     
     
         30 . A polishing liquid set comprising constituent components of a polishing liquid separately stored as a first liquid and a second liquid, so that the first liquid and second liquid are mixed to form the polishing liquid,
 wherein the first liquid is the slurry according to  claim 26 , and the second liquid comprises an additive and water.   
     
     
         31 . A polishing liquid comprising abrasive grains, an additive and water,
 the abrasive grains including a tetravalent metal element hydroxide, and producing absorbance of at least 1.50 for light with a wavelength of 400 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, and producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, wherein   a content of the abrasive grains is 0.01-10 mass % based on the total mass of the polishing liquid.   
     
     
         32 . A polishing liquid comprising abrasive grains, an additive and water,
 the abrasive grains including a tetravalent metal element hydroxide, and producing absorbance of at least 1.000 for light with a wavelength of 290 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %, and producing light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass %, wherein   a content of the abrasive grains is 0.01-10 mass % based on the total mass of the polishing liquid.   
     
     
         33 . The polishing liquid according to  claim 31 , wherein the abrasive grains produce absorbance of not greater than 0.010 for light with a wavelength of 450-600 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %. 
     
     
         34 . The polishing liquid according to  claim 32 , wherein the abrasive grains produce absorbance of not greater than 0.010 for light with a wavelength of 450-600 nm in an aqueous dispersion with a content of the abrasive grains adjusted to 0.0065 mass %. 
     
     
         35 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while supplying the slurry according to  claim 25  between the abrasive pad and the film to be polished.   
     
     
         36 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while supplying the slurry according to  claim 26  between the abrasive pad and the film to be polished.   
     
     
         37 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad,   a step of mixing the first liquid and second liquid of the polishing liquid set according to  claim 29  to obtain the polishing liquid, and   a step of polishing at least a portion of the film to be polished while supplying the polishing liquid between the abrasive pad and the film to be polished.   
     
     
         38 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad,   a step of mixing the first liquid and second liquid of the polishing liquid set according to  claim 30  to obtain the polishing liquid, and   a step of polishing at least a portion of the film to be polished while supplying the polishing liquid between the abrasive pad and the film to be polished.   
     
     
         39 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while respectively supplying both the first liquid and second liquid of the polishing liquid set according to  claim 29  between the abrasive pad and the film to be polished.   
     
     
         40 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while respectively supplying both the first liquid and second liquid of the polishing liquid set according to  claim 30  between the abrasive pad and the film to be polished.   
     
     
         41 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while supplying the polishing liquid according to  claim 31  between the abrasive pad and the film to be polished.   
     
     
         42 . A substrate polishing method comprising:
 a step of placing a film to be polished, of a substrate which has the film to be polished on its surface, so as to face an abrasive pad, and   a step of polishing at least a portion of the film to be polished while supplying the polishing liquid according to  claim 32  between the abrasive pad and the film to be polished.