US2018250640A1PendingUtilityA1

Porous film and method for producing same

Assignee: TOKYO OHKA KOGYO CO LTDPriority: Sep 4, 2015Filed: Aug 31, 2016Published: Sep 6, 2018
Est. expirySep 4, 2035(~9.1 yrs left)· nominal 20-yr term from priority
H01M 50/403H01M 50/489H01M 50/414C08L 81/06C08J 2381/06C08J 2327/16C08J 2201/044B01D 71/68B01D 71/34C08J 9/26C08L 79/08C08J 2379/08C08J 9/0066B01D 69/02B01D 67/002H01M 10/0525Y02E60/10B01D 71/64B01D 69/12H01M 2/1653B01D 67/003B01D 71/641B01D 69/1213B01D 69/1216B01D 2325/021H01M 50/446
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Claims

Abstract

Provided are a porous film having excellent surface smoothness and a method for producing the same. The surface roughness of a porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide is Ra 30,000 Å or less. The opening diameter of the porous film is preferably from 100 nm to 5000 nm. The method for producing a porous film preferably includes a step for kneading a varnish containing fine particles and at least one resin selected from the group consisting of polyvinylidene fluoride, polyether sulfone, polyamic acid, polyimide, polyamide-imide precursor, and polyamide-imide. The varnish preferably has a viscosity at 25° C. of 0.1-3 Pa·s, a solids fraction concentration of 10-50 mass %, and a fine particle average particle size of 10-5000 nm.

Claims

exact text as granted — not AI-modified
1 . A porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide,
 wherein surface roughness Ra is 30000 Å or less.   
     
     
         2 . The porous film according to  claim 1 , wherein an opening diameter in a surface is 10 nm to 5000 nm. 
     
     
         3 . The porous film according to  claim 1 , wherein the surface roughness Ra is surface roughness Ra on a surface opposite to a surface facing a substrate during production. 
     
     
         4 . A porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide,
 wherein the porous film includes a structure in which spherical pores communicate with each other,   no waviness is deeper than a recess formed by an opening portion, and   a diameter of the opening portion is 10 nm to 5000 nm.   
     
     
         5 . A method for producing a porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide, the method comprising:
 kneading a varnish containing fine particles and resin such that surface roughness Ra of an unburned composite film containing the fine particles and the resin that is at least one resin selected from the group consisting of polyvinylidene fluoride, polyethersulfone, polyamide acid, polyimide, a polyamide-imide precursor and polyamide-imide, is 30000 Å or less.   
     
     
         6 . A method for producing a porous film of polyvinylidene fluoride, polyethersulfone, polyimide and/or polyamide-imide, the method comprising:
 kneading a varnish containing fine particles, and at least one resin selected from the group consisting of polyvinylidene fluoride, polyethersulfone, polyamide acid, polyimide, a polyamide-imide precursor and polyamide-imide,   wherein the varnish has a viscosity at 25° C. of 0.1 to 3 Pa·s, a solid content concentration of 10 to 50% by mass, and an average particle diameter of the fine particles of 10 to 5000 nm, and   the kneading is carried out for 2 minutes to 10 hours.   
     
     
         7 . The porous film according to  claim 2 , wherein the surface roughness Ra is surface roughness Ra on a surface opposite to a surface facing a substrate during production.

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