Light emitting device and method of manufacturing a light emitting device

Abstract

A light emitting portion (200) is formed on a first surface of a substrate (100) (upper surface of the substrate (100) in an example illustrated in FIG. 1). A sealing member (300) seals the light emitting portion (200). In addition, the substrate (100) includes a first resin layer (110), a first inorganic layer (120), and a second resin layer (130). The first resin layer (110) is formed of a first resin material. The second resin layer (130) is formed of the first resin material, and is positioned closer to the first surface side of the substrate (100) than the first resin layer (110). The first inorganic layer (120) is positioned between the first resin layer (110) and the second resin layer (130).

1 . A light emitting device, comprising:
 a flexible substrate;   a light emitting portion formed over a first surface of the substrate; and   a sealing portion sealing the light emitting portion,   wherein the substrate includes:   a first resin layer which has a first resin material,   a second resin layer which has the first resin material and is positioned closer to the first surface side than the first resin layer, and   a first inorganic layer which is positioned between the first resin layer and the second resin layer.   
     
     
         2 . The light emitting device according to  claim 1 ,
 wherein the first resin layer is thinner than the second resin layer.   
     
     
         3 . The light emitting device according to  claim 2 ,
 wherein the first resin material has an imide bond.   
     
     
         4 . The light emitting device according to  claim 2 ,
 wherein further includes a second inorganic layer formed over a first surface side of the second resin layer.   
     
     
         5 . The light emitting device according to  claim 2 ,
 wherein the substrate is formed by forming the first resin layer, the first inorganic layer, and the second resin layer over a support substrate, and then by removing the support substrate.   
     
     
         6 . The light emitting device according to  claim 5 ,
 wherein the first resin layer includes a plurality of particles.   
     
     
         7 . The light emitting device according to  claim 5 ,
 wherein the substrates further includes a third resin layer which is disposed closer to the first surface side than the second resin layer, and   the third resin layer is formed of a second resin material which is different from the first resin material.   
     
     
         8 . A method of manufacturing a light emitting device, comprising:
 forming a substrate over a support substrate;   forming a light emitting portion over the substrate; and   forming a sealing portion sealing the light emitting portion over the substrate,   wherein the step of forming the substrate includes:   forming a first resin layer over the support substrate by using a first resin material;   forming a first inorganic layer over the first resin layer; and   forming a second resin layer over the first inorganic layer by using the first resin material.   
     
     
         9 . The method of manufacturing a light emitting device according to  claim 8 , further comprising
 removing the support substrate from the substrate.   
     
     
         10 . The method of manufacturing a light emitting device according to  claim 9 ,
 wherein the step of forming the first resin layer includes forming the first resin layer over a surface of the support substrate having concavities and convexities.