Method for manufacturing device, and composition

Abstract

A method for manufacturing a device including a substrate and a second film disposed above the substrate includes: forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and forming the second film by curing the first film in a state where at least one part of a mold having a convexo-concave pattern is in contact with the first film, or after at least one part of the mold is brought into contact with the first film. The oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more. The composition satisfies a relationship of (t0(T)-tx(T))/t0(T)×100≤13.0. (t0(T) is a height of a convex part of cured film obtained by the specific method, and tx(T) is the corresponding height after heating at 260° C.)

1 . A method for manufacturing a device including a substrate and a second film disposed above the substrate, comprising:
 forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and   forming the second film by curing the first film in a state where at least one part of a mold having a convexo-concave pattern is in contact with the first film, or after at least one part of the mold is brought into contact with the first film,   wherein the oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more, and   the composition satisfies a relationship of (t 0(T) -t x(T) )/t 0(T) ×100≤13.0,   where t 0(T)  is a height of a convex part of a convexo-concave part of a cured film having the convexo-concave part obtained by forming a coating film using the composition and then by curing the coating film in a state where the coating film is in contact with a convexo-concave part in which a depth of a recess is 3 μm and a line width thereof is 5 μm, included in the mold, and   t x(T)  is a height of the convex part after the cured film is heated from 25° C. to 260° C. over five minutes, then a temperature of the cured film is held at 260° C. for five minutes, and the cured film is cooled to 25° C. over 30 minutes.   
     
     
         2 . The method according to  claim 1 , wherein the composition contains 0.05 to 10% by mass of the oxidation inhibitor. 
     
     
         3 . The method according to  claim 1 , wherein the oxidation inhibitor is a combination of the hindered amine compound and the hindered phenol compound. 
     
     
         4 . The method according to  claim 3 , wherein the hindered amine compound and the hindered phenol compound are blended such that the amount of the hindered phenol compound is 1 to 100 parts by mass relative to 10 parts by mass of the hindered amine compound. 
     
     
         5 . The method according to  claim 1 , wherein the hindered amine compound has a polymerizable group in a molecule thereof. 
     
     
         6 . The method according to  claim 1 , wherein the hindered phenol compound has a molecular weight of 1000 or more. 
     
     
         7 . A method for manufacturing a device including a substrate and a second film disposed above the substrate, comprising:
 forming a first film above the substrate using a composition containing a polymerizable monomer and an oxidation inhibitor; and   forming the second film by curing the first film in a state where at least one part of a mold having a convexo-concave pattern is in contact with the first film, or after at least one part of the mold is brought into contact with the first film,   wherein the oxidation inhibitor is a hindered amine compound and the blending amount of the hindered amine compound is 0.5% by mass or more in the composition, and   the composition satisfies a relationship of (t 0(L) -t x(L) )/t 0(L) ×100≤10.0,   where t 0(L)  is a height of a convex part of a convexo-concave part of a cured film having the convexo-concave part obtained by forming a coating film using the composition and then by curing the coating film in a state where the coating film is in contact with a convexo-concave part in which a depth of a recess is 3 μm and a line width thereof is 5 μm, included in the mold, and   t x(L)  is a height of the convex part after the cured film is irradiated with light at 60° C. for 60 days under a condition of 765 W/cm 2  with a xenon lamp.   
     
     
         8 . The method according to  claim 7 , wherein the composition contains 0.5 to 10% by mass of the oxidation inhibitor. 
     
     
         9 . The method according to  claim 7 , wherein the hindered amine compound has a polymerizable group in a molecule thereof. 
     
     
         10 . A composition comprising a polymerizable monomer and an oxidation inhibitor, used in the method according to  claim 1 , wherein the oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more. 
     
     
         11 . The composition according to  claim 10 , wherein hindered phenol compound has a molecular weight of 1000 or more. 
     
     
         12 . A composition comprising a polymerizable monomer and an oxidation inhibitor, used in the method according to  claim 7 , wherein the oxidation inhibitor is at least one of a hindered amine compound and a hindered phenol compound having a molecular weight of 700 or more. 
     
     
         13 . The composition according to  claim 12 , wherein the hindered phenol compound has a molecular weight of 1000 or more.