Electrical Connection Method of Printed Circuit and Electrical Connection Structure of Printed Circuit

Abstract

An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.

What is claimed is: 
     
         1 . An electrical connection method of a printed circuit, comprising:
 overlapping a base material and a thin member in which a thin conductor is mounted;   forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member; and   forming the printed circuit on the base material by a screen printing method using conductive paste,   wherein the through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.   
     
     
         2 . The electrical connection method of the printed circuit according to  claim 1 ,
 wherein the thin member in the overlapping is a flat shield cable covered with a shield member except one portion of the thin member,   wherein in the forming of the through hole, a first through hole is formed to pass through the base material overlapped in the overlapping and to open the one portion of the thin member so as to reach the thin conductor, a second through hole is formed to pass through the base material overlapped in the overlapping to reach the shield member, and   wherein in the forming of the printed circuit, the first through hole is filled with the conductive paste when a signal line is formed as a first printed circuit on the base material, and the second through hole is filled with the conductive paste when a ground line is formed as a second printed circuit on the base material at the same time as the signal line is formed.   
     
     
         3 . The electrical connection method of the printed circuit according to  claim 1 ,
 wherein in the forming of the through hole, a plurality of through holes are formed, and   wherein in the forming of the printed circuit, the plurality of through holes are collectively filled with the conductive paste so as to electrically connect one circuit in the printed circuit to the thin conductor through the plurality of through holes when the printed circuit is formed on the base material.   
     
     
         4 . An electrical connection structure of a printed circuit, comprising:
 a thin member in which a thin conductor is mounted;   a base material which is placed on the thin member; and   a printed circuit which is formed on the base material,   wherein a through hole is formed in the base material,   wherein the through hole passes through the base material and reaches the thin conductor of the thin member,   wherein the printed circuit is formed on the through hole in the base material, and   wherein the through hole is filled with the same conductive member as the printed circuit.