Immersion cooling arrangements for electronic devices

Abstract

An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

1 . (canceled) 
     
     
         2 . The electronics cooling arrangement as recited in  claim 4 , wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing. 
     
     
         3 . The electronics cooling arrangement as recited in  claim 4 , further including a vent or small channel in fluid communication with the passageway and disposed between the inlet and the outlet. 
     
     
         4 . An electronics cooling arrangement, comprising:
 a housing configured to contain a coolant;   an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, the passageway being configured to allow fluid flowing between the inlet and the outlet to cool the electronic device; and   a plenum defined within the electronic device fluidly connected between the inlet and the vent or small channel.   
     
     
         5 . The electronics cooling arrangement as recited in  claim 4 , further including a pump in fluid communication with the passageway. 
     
     
         6 . The electronics cooling arrangement as recited in  claim 5 , wherein the pump is configured to urge fluid through the passageway. 
     
     
         7 . The electronics cooling arrangement as recited in  claim 5 , wherein the pump is contained within the housing. 
     
     
         8 . The electronics cooling arrangement as recited in  claim 5 , further including a control module operatively connected with the pump and configured to selectively operate the pump according to heat generated by the electronic device. 
     
     
         9 . The electronics cooling arrangement as recited in  claim 4 , wherein the electronic device defines at least one of the inlet, the passageway, and the outlet. 
     
     
         10 . The electronics cooling arrangement as recited in  claim 4 , wherein the housing is a sealed housing. 
     
     
         11 . The electronics cooling arrangement as recited in  claim 4 , further including a dielectric coolant. 
     
     
         12 . The electronics cooling arrangement as recited in  claim 11 , wherein the electronic component being submerged within a liquid phase of the dielectric coolant. 
     
     
         13 . The electronics cooling arrangement as recited in  claim 4 , wherein one or more of the inlet, the passageway, and the outlet are submerged within a coolant contained within the housing. 
     
     
         14 . The electronics cooling arrangement as recited in  claim 4 , wherein the electronic device includes an integrated circuit exposed to an interior of the housing. 
     
     
         15 . The electronics cooling arrangement as recited in  claim 4 , wherein the electronic device includes an integrated circuit bounding the passageway. 
     
     
         16 . The electronics cooling arrangement as recited in  claim 4 , further comprising a hypodermic needle segment fluidly coupling the inlet with passageway. 
     
     
         17 . An immersion cooling arrangement, comprising:
 a sealed housing;   a dielectric coolant disposed within the housing;   an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet; and   a plenum defined within the electronic device fluidly connected between the inlet and the vent or small channel,   wherein the inlet is submerged within the dielectric coolant,   wherein the outlet is submerged within the dielectric coolant, and   wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing.   
     
     
         18 . A method of cooling an electronic device, comprising:
 introducing fluid from an interior of a housing into a passageway defined by the electronic device;   flowing fluid through the passageway; and   transferring heat from the electronic device to the fluid flowing through the passageway, wherein flowing fluid through the passageway includes flowing fluid through a plenum defined within the electronic device fluidly connected between the inlet and the vent or small channel.   
     
     
         19 . The method of cooling an electronic device as recited in  claim 18 , further comprising flowing heated coolant from the passageway into the interior of the housing. 
     
     
         20 . The method of cooling an electronic device as recited in  claim 18 , further comprising pumping coolant through the passageway. 
     
     
         21 . The method as recited in  claim 18 , further including flowing fluid between the external environment and the passageway through a vent or small channel in fluid communication with the passageway and disposed between the inlet and the outlet