Apparatus for post exposure bake

Abstract

Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

What is claimed is: 
     
         1 . A substrate processing apparatus, comprising:
 a chamber body defining a process volume;   a rotatable pedestal disposed within the process volume;   a fluid delivery arm configured to deliver cleaning fluid to the process volume; and   a shield movable between a raised position and a lowered position, the shield having an inner diameter greater than an outer diameter of the rotatable pedestal, wherein the shield is disposed radially outward of the rotatable pedestal.   
     
     
         2 . The apparatus of  claim 1 , wherein the rotatable pedestal includes a vacuum chuck. 
     
     
         3 . The apparatus of  claim 2 , wherein a fluid conduit is formed in the pedestal. 
     
     
         4 . The apparatus of  claim 3 , wherein the fluid conduit is in fluid communication with a cooling fluid source. 
     
     
         5 . The apparatus of  claim 1 , wherein the fluid delivery arm is coupled to the chamber body and extends through the process volume radially inward of the outer diameter of the rotatable pedestal. 
     
     
         6 . The apparatus of  claim 5 , wherein the fluid delivery arm comprises one or more nozzles. 
     
     
         7 . The apparatus of  claim 6 , wherein the fluid delivery arm and the one or more nozzles are in fluid communication with a rinse fluid source. 
     
     
         8 . The apparatus of  claim 7 , wherein the fluid delivery arm and the one or more nozzles are configured to dispense a developer material comprising tetramethlyammonium hydroxide. 
     
     
         9 . The apparatus of  claim 1 , wherein the shield is ring shaped. 
     
     
         10 . The apparatus of  claim 1 , wherein the shield is configured to extend above the rotatable pedestal when the shield is disposed in the raised position. 
     
     
         11 . The apparatus of  claim 10 , wherein the shield is configured to be positioned below the pedestal in the lowered position during loading and unloading of a substrate on the rotatable pedestal. 
     
     
         12 . The method of  claim 1 , further comprising:
 a drain coupled to the chamber body and in fluid communication with the process volume, wherein the drain is coupled to the chamber body radially inward of the inner diameter of the shield.   
     
     
         13 . A method of processing a substrate, comprising:
 lowering a ring shaped shield which has an inner diameter greater than an outer diameter of a pedestal;   positioning a substrate on the pedestal;   raising the ring shaped shield to a position that extends above the substrate;   flowing cooling fluid through fluid conduits formed in the pedestal;   rinsing the substrate by delivering a rinse fluid through a fluid delivery arm; and   rotating the pedestal to spin dry the substrate.   
     
     
         14 . The method of  claim 13 , further comprising:
 delivering a developer material to the substrate after spin drying the substrate.   
     
     
         15 . The method of  claim 14 , wherein the developer material comprises tetramethlyammonium hydroxide. 
     
     
         16 . The method of  claim 13 , wherein the ring shaped shield is disposed in the position that extends above the substrate during the flowing cooling fluid through fluid conduits formed in the pedestal, during the rinsing the substrate, and during the rotating the pedestal to spin dry the substrate. 
     
     
         17 . The method of  claim 14 , further comprising:
 lowering the ring shaped shield after spin drying the substrate and delivering the developer material; and   unloading the substrate from the pedestal.   
     
     
         18 . A method of processing a substrate, comprising:
 positioning a substrate adjacent to a process volume in a process chamber;   delivering a process fluid to the process volume at a first flow rate;   after filling a portion of the process volume with process fluid, delivering the process fluid to the process volume at a second flow rate greater than the first flow rate;   after completely filling the process volume with process fluid, delivering the process fluid to the process volume at a third flow rate less than the second flow rate; and   generating an electric field in the process volume during the delivering the process fluid to the process volume at a third flow rate.   
     
     
         19 . The method of  claim 18 , wherein the first and third flow rates are less than about 5 L/min. 
     
     
         20 . The method of  claim 19 , wherein the second flow rate is greater than about 5 L/min.