US2018213674A1PendingUtilityA1
Electronic equipment data center or co-location facility designs and methods of making and using the same
Est. expiryJun 14, 2027(~0.9 yrs left)· nominal 20-yr term from priority
Inventors:Rob Roy
H05K 7/20745H05K 7/20
62
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
The present invention relates to electronic equipment data center or co-location facility designs and methods of making and using the same in an environmentally aware manner, and generally provides apparatus and methods for using novel support bracket structures, and thermal panels associated with the same, that allow for distinct partitioning of air flowing in hot aisles and cold aisles, as well as for holding wiring above cabinets that are used to store electronic equipment in the facility.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A process for managing heat emitted by electronic equipment comprising the steps of:
providing at least one cluster of cabinets disposed in two separated rows; positioning the two separated rows of cabinets in a back-to-back configuration to establish a hot aisle enclosure area between the two separated rows, the front side of the cabinets establishing a portion of a cold aisle, and disposing the electronic equipment in the cabinets such that the electronic equipment emits heated air from the cabinets into the hot aisle enclosure area; positioning a thermal shield above the cabinets, the thermal shield extending upward from the cabinets to form a hot air area above the hot aisle enclosure area, the thermal shield containing the heated air rising from the hot aisle enclosure area in the hot air area and the hot aisle enclosure area, the thermal shield surrounding the hot air area above the at least one cluster of cabinets; placing at least one cable rack at an elevation higher than at least one of the rows of cabinets to support cables in the cold aisle; providing an air conditioning system that includes an air conditioning unit located above the cabinets, and a condenser that is disposed outside the walls of the facility, the air conditioning system drawing in the heated air from the hot air area into a warm air channel disposed above the hot air area, the warm air channel being bounded by a barrier having one or more openings through which heated air flows into the warm air channel, and wherein the thermal shield extends from the barrier to the cabinets to thus surround the hot air area with the thermal shield to contain the heated air; and delivering cool air from the air conditioning system to the cold aisle through a cool air channel that extends from the air conditioning system and the cold aisle.
2 . The process of claim 1 wherein the heated air rises from the cabinets in the hot aisle enclosure area toward the air conditioning units and air cooled by the air conditioning units falls toward the cabinets in the cold aisle.
3 . The process of claim 1 further comprising the step of providing at least one support bracket that extends upward from a floor to support the thermal shield.
4 . The process of claim 3 wherein the at least one support bracket also support one or more cable racks.
5 . The process of claim 3 wherein the at least one support brackets are not connected to the cabinets.
6 . The process of claim 1 wherein the barrier prevents the heated air from mixing with the cooled air.
7 . The process of claim 1 wherein the top edge of the thermal shield is connected to the barrier.
8 . A process for managing heat emitted by electronic equipment comprising the steps of:
providing at least one cluster of cabinets disposed in two separated rows; positioning the two separated rows of cabinets in a back-to-back configuration to establish a hot aisle enclosure area between the two separated rows, the front side of the cabinets establishing a cold aisle, and disposing the electronic equipment in the cabinets such that the electronic equipment emits heated air from the cabinets into the hot aisle enclosure area; positioning a thermal shield above the cabinets, the thermal shield extending upward from the cabinets to form a hot air area above the hot aisle enclosure area, the thermal shield containing the heated air rising from the hot aisle enclosure area in the hot air area and the hot aisle enclosure area, the thermal shield surrounding the hot air area above the at least one cluster of cabinets; and providing an air conditioning system, the air conditioning system drawing in the heated air from the hot air area into a warm air channel disposed above the hot air area, the warm air channel being bounded by a barrier having one or more openings through which heated air flows into the warm air channel, and wherein the thermal shield extends from the barrier to the cabinets to separate the heated air from the cold aisle.
9 . The process of claim 8 wherein the air conditioning system includes a condenser that is disposed outside the walls of the facility.
10 . The process of claim 8 wherein the air conditioning system includes air conditioning units that are located above the cabinets and the barrier such that heated air rises toward the air conditioning units and air cooled by the air conditioning units falls toward the cabinets in the cool aisle.
11 . The process of claim 8 further comprising the step of providing at least one support bracket above the cabinets which support the thermal shield.
12 . The process of claim 8 further comprising the step of providing a rack configured to support cables in the cool aisle above at least one row of cabinets.
13 . The process of claim 8 wherein the top edge of the thermal shield connects to the barrier.
14 . A process for managing heat emitted by electronic equipment comprising the steps of:
positioning two separated rows of cabinets in a back-to-back configuration; locating the electronic equipment in the cabinets such that the electronic equipment emits heated air from the cabinets into a hot aisle between the two separated rows of cabinets; assembling a thermal shield above the cabinets, the thermal shield extending upward from the cabinets to contain the heated air above the hot aisle within the thermal shield; directing the heated air from within the thermal shield to one or more air conditioning systems; and delivering cool air from the one or more air conditioning systems to at least one cold aisle positioned on a front side of at least one of the two separated rows of cabinets.
15 . The process of claim 14 further comprising the steps of:
locating one or more elements of the air conditioning system outside of a building which contains the rows of cabinets; and
locating one or more elements of the air conditioning system inside the building which contains the rows of cabinets.
16 . The process of claim 14 further comprising the step of disposing the air conditioning units above the cabinets such that heated air rises toward the air conditioning units and air cooled by the air conditioning units falls toward the cabinets in the cool aisle.
17 . The process of claim 14 further comprising the step of disposing a condenser of the air conditioning system outside the walls of the facility.
18 . The process of claim 14 further comprising the step of disposing the cabinets on a non-raised floor.
19 . The process of claim 14 further comprising the step of disposing one or more support brackets above the cabinets which support the thermal shield.
20 . The process of claim 19 wherein the one or more support brackets are not connected to the cabinets.Join the waitlist — get patent alerts
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