Light emitting diode display and fabricating method thereof

Abstract

A light emitting diode display including at least one light emitting diode chip is provided. The light emitting diode chip includes a first substrate, a plurality of light emitting diodes, a first insulation layer and a plurality of switch devices. The plurality of light emitting diodes are disposed on the first substrate. The first insulation layer covers the plurality of light emitting diodes. The plurality of switch devices are disposed on the first insulation layer and electrically connected to the plurality of light emitting diodes. Moreover, a fabricating method of the light emitting diode display is also provided.

1 . A light emitting diode display, comprising:
 at least one light emitting diode chip, the at least one light emitting diode chip comprising:   a first substrate;   a second substrate, disposed on the first substrate;   a plurality of light emitting diodes, directly disposed on the second substrate, wherein the second substrate is located between the light emitting diodes and the first substrate;   a first insulation layer, covering the light emitting diodes; and   a plurality of switch devices, disposed on the first insulation layer and electrically connected to the light emitting diodes.   
     
     
         2 . The light emitting diode display according to  claim 1 , wherein the first insulation layer has a plurality of first contact holes exposing the light emitting diodes, and the switch devices are electrically connected to the light emitting diodes via the first contact holes. 
     
     
         3 . The light emitting diode display according to  claim 2 , wherein each of the light emitting diodes comprises:
 a first type semiconductor layer;   a second type semiconductor layer opposite to the first type semiconductor layer; and   a light emitting layer, located between the first type semiconductor layer and the second type semiconductor layer, wherein the switch devices are electrically connected to a plurality of first type semiconductor layers of the light emitting diodes via the first contact holes.   
     
     
         4 . The light emitting diode display according to  claim 3 , wherein the at least one of the light emitting diode chips further comprises:
 a plurality of conductive patterns, disposed on the first insulation layer, wherein the first insulation layer further has a plurality of second contact holes exposing the light emitting diodes and being separated from the first contact holes, and the conductive patterns are electrically connected to a plurality of the second type semiconductor layers of the light emitting diodes via the second contact holes.   
     
     
         5 . The light emitting diode display according to  claim 1 , wherein the first substrate has a groove, and the light emitting diodes are disposed in the groove. 
     
     
         6 . (canceled) 
     
     
         7 . The light emitting diode display according to  claim 1 , wherein the first substrate has a groove, and the second substrate and the light emitting diodes are disposed in the groove. 
     
     
         8 . The light emitting diode display according to  claim 1 , wherein the first insulation layer completely covers the first substrate. 
     
     
         9 . The light emitting diode display according to  claim 1 , wherein the first insulation layer partially covers the first substrate. 
     
     
         10 . The light emitting diode display according to  claim 9 , wherein two adjacent light emitting diodes have a gap therebetween, such that the light emitting diodes are separated from each other, the gap corresponds to a portion of the first substrate, and the first insulation layer uncovers the portion of the first substrate. 
     
     
         11 . The light emitting diode display according to  claim 1 , wherein the at least one of the light emitting diode chips further comprises:
 a second insulation layer, covering the switch devices.   
     
     
         12 . The light emitting diode display according to  claim 11 , wherein the at least one of the light emitting diode chips further comprises:
 a fourth substrate, covering the second insulation layer.   
     
     
         13 . The light emitting diode display according to  claim 1 , wherein the at least one light emitting diode chip is a plurality of light emitting diode chips, and the light emitting diode display further comprises:
 a conductive wire, disposed on the first insulation layer and electrically connected between two adjacent light emitting diode chips.   
     
     
         14 . A fabricating method of a light emitting diode display, comprising:
 providing a first substrate and a plurality of light emitting diodes disposed on the first substrate;   forming a first insulation layer to cover the light emitting diodes; and   forming a plurality of switch devices on the first insulation layer, wherein the switch devices are electrically connected to the light emitting diodes.   
     
     
         15 . The fabricating method of the light emitting diode display according to  claim 14 , further comprising:
 forming the light emitting diodes on a second substrate; and   making the second substrate and the light emitting diodes be disposed on the first substrate, wherein the second substrate is located between the light emitting diodes and the first substrate.   
     
     
         16 . The fabricating method of the light emitting diode display according to  claim 14 , further comprising:
 forming the light emitting diodes on a second substrate;   making a third substrate pick up the light emitting diodes and the second substrate;   removing the second substrate; and   making the third substrate dispose the light emitting diodes on the first substrate.   
     
     
         17 . The fabricating method of the light emitting diode display according to  claim 14 , further comprising:
 forming a second insulation layer to cover the switch devices.   
     
     
         18 . The fabricating method of the light emitting diode display according to  claim 17 , further comprising:
 making the second insulation layer, the switch devices, the first insulation layer, the light emitting diodes and the first substrate be fixed on a fourth substrate, wherein the second insulation layer is located between the fourth substrate and the first insulation layer; and   removing the first substrate.   
     
     
         19 . The fabricating method of the light emitting diode display according to  claim 18 , further comprising:
 after removing the first substrate, making the fourth substrate be separated from the second insulation layer.   
     
     
         20 . A light emitting diode display, comprising:
 at least one light emitting diode chip, the at least one light emitting diode chip comprising:   a first substrate;   a plurality of light emitting diodes, directly disposed on the first substrate;   a first insulation layer, covering the light emitting diodes; and   a plurality of switch devices, disposed on the first insulation layer and electrically connected to the light emitting diodes.