Electrochemical deposition apparatus and methods of using the same

Abstract

An electrochemical deposition apparatus and methods of using the same are provided herein.

What is claimed is: 
     
         1 . An electrochemical deposition apparatus, comprising:
 a. a support structure;   b. a first electrode mount connected to the support structure;   c. a second electrode mount connected to the support structure; and   d. a deposition chamber frame configured to receive a deposition solution and disposed proximate to the first and second electrode mounts, the deposition chamber frame comprising:
 i. a first aperture portion configured to face the first electrode mount, the first aperture portion comprising a first aperture and a conductive perimeter element; and 
 ii. a second aperture portion configured to face the second electrode mount, the second aperture portion comprising a second aperture. 
   
     
     
         2 . The apparatus of  claim 1 , comprising at least one biasing member that connects the support structure to at least one of the first electrode mount and the second electrode mount. 
     
     
         3 . The apparatus of  claim 2 , wherein the at least one biasing member comprises a spring, a clamp, an actuator, or a combination thereof. 
     
     
         4 . The apparatus of  claim 2 , wherein the at least one biasing member connects the support structure to the first electrode mount and comprises a pneumatic actuator. 
     
     
         5 . The apparatus of  claim 1 , wherein the second aperture is larger than the first aperture. 
     
     
         6 . The apparatus of  claim 1 , comprising a first electrode connected to the first electrode mount and configured to be disposed in electrical communication with the conductive perimeter element. 
     
     
         7 . The apparatus of  claim 6 , wherein the first electrode comprises a material selected from the group consisting of indium-tin-oxide (ITO), poly (ethylene terephthalate) (PET), glass, and a combination thereof. 
     
     
         8 . The apparatus of  claim 6 , wherein the first electrode comprises a conductive sheet. 
     
     
         9 . The apparatus of  claim 1 , wherein the conductive perimeter element comprises at least one electrode contact. 
     
     
         10 . The apparatus of  claim 9 , wherein the at least one electrode contact comprises a plurality of electrode contacts. 
     
     
         11 . The apparatus of  claim 10 , wherein the plurality of electrode contacts comprises a plurality of spring-loaded contact pins. 
     
     
         12 . The apparatus of  claim 1 , comprising a second electrode connected to the second electrode mount. 
     
     
         13 . The apparatus of  claim 12 , wherein the second electrode comprises one or more of graphite, gold, and platinum. 
     
     
         14 . The apparatus of  claim 12 , wherein the second electrode comprises a conductive sheet. 
     
     
         15 . The apparatus of  claim 1 , comprising a controller in electrical communication with the conductive perimeter element. 
     
     
         16 . The apparatus of  claim 1 , comprising first and second electrodes connected to the first and second electrode mounts, respectively, wherein the first electrode comprises a working electrode and the second electrode comprises a counter electrode. 
     
     
         17 . The apparatus of  claim 16 , comprising a controller in electrical communication with the conductive perimeter element and the counter electrode. 
     
     
         18 . The apparatus of  claim 1 , comprising a reference electrode configured to be disposed within the deposition chamber frame. 
     
     
         19 . The apparatus of  claim 18 , wherein the reference electrode comprises one or more of an Ag/AgCl reference electrode, a Pt wire quasi-reference electrode, and an Au wire quasi-reference electrode. 
     
     
         20 . The apparatus of  claim 1 , comprising a container in fluid communication with the deposition chamber frame; wherein the container is configured to contain a deposition solution that comprises a coating material. 
     
     
         21 . An electrochemical deposition apparatus comprising an electroplating vessel, the apparatus comprising:
 a. a support structure;   b. a frame disposed within the support structure and comprising a cavity configured to receive a deposition solution, the cavity comprising:
 i. a first aperture portion comprising a first aperture; and 
 ii. a second aperture portion comprising a second aperture, wherein the second aperture is larger than the first aperture; 
   c. a working electrode disposed proximate to the first aperture; and   d. a counter electrode disposed proximate to the second aperture;   wherein the frame, the working electrode, and the counter electrode combine to form the electroplating vessel.   
     
     
         22 . The apparatus of  claim 21 , wherein the cavity comprises a telescoped cavity, a tapered cavity, or a combination thereof. 
     
     
         23 . The apparatus of  claim 21 , wherein the second aperture is at least twice as large as the first aperture. 
     
     
         24 . The apparatus of  claim 21 , comprising a plurality of guides that are configured to align the frame, the working electrode, and the counter electrode. 
     
     
         25 . A method for electrochemically depositing a coating material on a working electrode with the electrochemical deposition apparatus of  claim 1 , the method comprising the steps of:
 a. mounting a working electrode at the first electrode mount;   b. mounting a counter electrode at the second electrode mount;   c. preparing a deposition chamber by:
 i. biasing the working electrode against the first aperture portion of the deposition chamber frame; and 
 ii. biasing the counter electrode against the second aperture portion of the deposition chamber frame; 
   e. providing a deposition solution to the deposition chamber, wherein the deposition solution comprises a coating material;   f applying a potential across the working electrode and the counter electrode to electrochemically deposit the coating material at the working electrode; and   g. removing the working electrode, having the coating material deposited thereon, from the first electrode mount.   
     
     
         26 . The method of  claim 25 , wherein the step of providing the deposition solution to the deposition chamber comprises gravity flowing the deposition solution to the deposition chamber from a container that is in fluid communication with the deposition chamber by raising the container above the deposition chamber. 
     
     
         27 . The method of  claim 25 , wherein the step of removing the working electrode comprises removing the deposition solution from the deposition chamber by gravity flowing the deposition solution to the container from the deposition chamber by lowering the container below the deposition chamber. 
     
     
         28 . The method of  claim 25 , wherein the step of applying a potential across the working electrode and counter electrode comprises applying a linear scan applied potential, which comprises scanning the applied potential from a pre-determined initial potential to a pre-determined final potential at a pre-determined scan rate. 
     
     
         29 . The method of  claim 25 , wherein the step of applying a potential across the working electrode and counter electrode comprises applying a fixed applied potential, which comprises applying a pre-determined fixed potential until:
 i. a pre-determined total charge is achieved; or   ii. a pre-determined total deposition time has elapsed.   
     
     
         30 . The method of  claim 25 , wherein the step of preparing the deposition chamber comprises at least one of:
 i. pneumatically biasing the working electrode against the first aperture portion of the deposition chamber frame; and   ii. pneumatically biasing the counter electrode against the second aperture portion of the deposition chamber frame.