High speed communication jack

Abstract

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

1 . A high speed communication jack including:
 a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;   a shielding case surrounding the housing;   a circuit board in the housing having
 a substrate, 
 a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, 
 a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, 
 a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and 
 a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via; 
   wherein an isolation region is disposed on the top surface between the second set of traces.   
     
     
         2 . The jack of  claim 1  wherein the second set of traces connect different vias than the vias connected on the top surface. 
     
     
         3 . The jack of  claim 1  including another isolation region on the top surface between the first set of traces. 
     
     
         4 . The jack of  claim 1  including an isolation plane extending around the periphery of the substrate opposite the top layer. 
     
     
         5 . The jack of  claim 4  wherein the isolation plane is comprised of copper and finished silver. 
     
     
         6 . The jack of  claim 3  wherein the isolation regions are comprised of copper and finished silver. 
     
     
         7 . The jack of  claim 4  wherein the isolation plane is made of a material that is ¼ oz copper and ¼ oz silver. 
     
     
         8 . The jack of  claim 3  wherein the isolation regions are made of a material that is ¼ oz copper and ¼ oz silver. 
     
     
         9 . The jack of  claim 4  wherein the isolation plane includes a plurality of vias that connect the isolation plane connects to a grounding plane. 
     
     
         10 . A high speed communication jack including:
 a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;   a shielding case surrounding the housing;   a circuit board in the housing having
 a substrate, 
 a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, 
 a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, 
 a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and 
 a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via; 
   wherein an isolation plane extends around a periphery of the substrate opposite the top layer.   
     
     
         11 . The jack of  claim 10  wherein the second set of traces connect different vias that the vias connected on the top surface. 
     
     
         12 . The jack of  claim 10  including a first isolation region on the top surface between the first set of traces. 
     
     
         13 . The jack of  claim 10  including a second isolation region on the top surface between a second set of traces. 
     
     
         14 . The jack of  claim 10  wherein the isolation plane is comprised of copper and finished silver. 
     
     
         15 . The jack of  claim 12  wherein the first isolation region is comprised of copper and finished silver. 
     
     
         16 . The jack of  claim 14  wherein the isolation plane is made of a material that is ¼ oz copper and ¼ oz silver. 
     
     
         17 . The jack of  claim 15  wherein the isolation plane is made of a material that is ¼ oz copper and ¼ oz silver. 
     
     
         18 . The jack of  claim 10  wherein the isolation plane includes a plurality of vias that connect the isolation plane to a grounding plane.