Articles coated with a fluoro-annealed film

Abstract

Articles and methods relating to coatings having superior chemical resistance and structural integrity, can be prepared via atomic layer deposition and fluoro-annealing at low process temperatures of between about 150° C. and less than 300° C. The film comprises a fluorinated metal oxide containing yttrium.

What is claimed is: 
     
         1 . An article, comprising:
 a substrate;   a protective film overlying at least a portion of the substrate, the film has a thickness of between 0.01 microns and less than 1 microns and comprises a fluorinated metal oxide containing yttrium.   
     
     
         2 . The article of  claim 1 , wherein the protective film is fully fluorinated or partially fluorinated. 
     
     
         3 . The article of  claim 1 , wherein the protective film is yttrium oxyfluoride or yttrium aluminum oxyfluoride. 
     
     
         4 . The article of  claim 1 , wherein the film is a graded film and wherein the fluorine content of the film decreases over a thickness of the film from an outer portion comprising yttrium oxyfluoride to an inner portion comprising yttria. 
     
     
         5 . The article of  claim 1 , wherein the film is a graded film and wherein the fluorine content of the film decreases over a thickness of the film from an outer portion comprises yttrium aluminum oxyfluoride to an inner portion comprises yttrium aluminum oxide. 
     
     
         6 . The article of  claim 1 , wherein the film has a thickness of between 0.01 microns and 0.7 microns. 
     
     
         7 . The article of  claim 1 , wherein an outer portion of the protective film has a higher fluorine content than an inner portion of the protective film that directly contacts the substrate. 
     
     
         8 . The article of  claim 1 , wherein the protective film is a graded film and wherein a fluorine content of the film decreases over a thickness of the film from an outer portion of the film that contains more fluorine to an inner portion of the film that directly contacts the substrate and that contains less fluorine than the outer portion of the film. 
     
     
         9 . A method comprising:
 atomic layer depositing a metal oxide containing yttrium onto a substrate, the metal oxide forming a film with a thickness of between 0.01 microns and less than 1 microns overlying the substrate; and   fluoro-annealing the film.   
     
     
         10 . The method of  claim 9 , wherein the fluoro-annealing is performed on the substrate that is held at a temperature of between about 150° C. to less than about 300° C. in fluorine containing atmosphere. 
     
     
         11 . The method of  claim 9 , wherein the fluoro-annealing is performed on the substrate that is held at a temperature of between about 200° C. to about 250° C. in fluorine containing atmosphere.