Method of manufacturing a high definition heater system

Abstract

A method of manufacturing a heater includes forming a first laminate having a first double-sided adhesive dielectric layer, a sacrificial layer, and a conductive layer. The first double sided adhesive layer is disposed between the sacrificial layer and the conductive layer. Next, a circuit pattern is created into the conductive layer, followed by covering the circuit pattern with a second double-sided adhesive dielectric layer. Thereafter, the second double-sided adhesive dielectric layer is covered with a dielectric layer to form a second laminate. Finally, the sacrificial layer is completely removed to form the heater comprising the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer.

What is claimed is: 
     
         1 . A method of manufacturing a heater, the method comprising:
 forming a first laminate having a first double-sided adhesive dielectric layer, a sacrificial layer, and a conductive layer, the first double sided adhesive layer being disposed between the sacrificial layer and the conductive layer;   creating a circuit pattern into the conductive layer;   covering the circuit pattern with a second double-sided adhesive dielectric layer;   covering the second double-sided adhesive dielectric layer with a dielectric layer to form a second laminate; and   completely removing the sacrificial layer to form the heater comprising the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer.   
     
     
         2 . The method according to  claim 1 , further comprising pressing the second laminate before the completely removing the sacrificial layer. 
     
     
         3 . The method according to  claim 1 , wherein the second laminate includes the sacrificial layer, the first double-sided adhesive layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer. 
     
     
         4 . The method according to  claim 3 , wherein the sacrificial layer is one of outermost layers of the second laminate. 
     
     
         5 . The method according to  claim 3 , wherein, in the second laminate, the circuit pattern and the sacrificial layer are disposed on opposing surfaces of the first double-sided adhesive dielectric layer, the sacrificial layer overlapping the circuit pattern. 
     
     
         6 . The method according to  claim 1 , wherein after the completely removing the sacrificial layer, the first double-sided adhesive layer becomes one of outermost layers of the heater. 
     
     
         7 . The method according to  claim 1 , wherein after the completely removing the sacrificial layer, the first double-sided adhesive layer and the dielectric layer become outermost layers of the heater. 
     
     
         8 . The method according to  claim 1 , wherein the sacrificial layer is a copper material. 
     
     
         9 . The method according to  claim 1 , wherein the first and second double-sided adhesive dielectric layers are formed of a polyimide material. 
     
     
         10 . The method according to  claim 1 , wherein the conductive layer is formed of a Nickel alloy material. 
     
     
         11 . The method according to  claim 1 , wherein the conductive layer and the dielectric layers each define a thickness between about 0.025 mm and about 0.050 mm. 
     
     
         12 . The method according to  claim 1 , wherein the circuit pattern is created by an etching process. 
     
     
         13 . A method of manufacturing a heater, the method comprising:
 forming a first laminate having a first double-sided adhesive dielectric layer, a sacrificial layer, and a conductive layer, the first double sided adhesive layer being disposed between the sacrificial layer and the conductive layer;   creating a circuit pattern into the conductive layer;   covering the circuit pattern with a second double-sided adhesive dielectric material;   covering the second double-sided adhesive dielectric layer with a dielectric layer to form a second laminate comprising the sacrificial layer, the first double-sided adhesive layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer;   pressing the second laminate; and   removing the sacrificial layer to form the heater comprising the first double-sided adhesive layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer, such that the first double-sided adhesive layer becomes one of outermost layers of the heater.   
     
     
         14 . A method of manufacturing a heater, the method comprising:
 forming a first laminate having a double-sided adhesive dielectric layer, a carrier layer on one side of the double-sided adhesive dielectric layer, and a conductive layer on an opposite side of the double-sided adhesive dielectric layer;   creating a circuit pattern into the conductive layer;   deforming the double-sided adhesive dielectric layer and the carrier layer into spaces between the circuit pattern to form a second laminate;   removing the carrier layer after the deforming to form a third laminate; and   joining the third laminate to an adjacent component.   
     
     
         15 . The method of  claim 14 , wherein the second laminate comprises the double-sided adhesive dielectric layer, the carrier layer, and the circuit pattern. 
     
     
         16 . The method of  claim 14 , wherein in the second laminate, the double-sided adhesive layer is disposed between the circuit pattern and the carrier layer, the carrier layer overlapping the circuit pattern. 
     
     
         17 . The method of  claim 14 , wherein the third laminate comprises the double-sided adhesive dielectric layer and the circuit pattern with the double-sided adhesive dielectric layer becoming an outermost layer of the third laminate. 
     
     
         18 . The method of  claim 14  further comprising completely removing the carrier layer so that the double-sided adhesive layer becomes an outermost layer of the third laminate. 
     
     
         19 . The method according to  claim 14 , wherein the sacrificial layer is a copper material. 
     
     
         20 . The method according to  claim 14 , wherein the double-sided adhesive dielectric layer is formed of a polyimide material.