Aluminum alloy plate having excellent moldability and bake hardening properties

Abstract

The purpose of the present invention is to provide an aluminum alloy plate capable of having a 0.2% proof stress during molding of no more than 110 MPa and a 0.2% proof stress after BH of at least 170 MPa. The present invention pertains to an aluminum alloy plate including, in mass %, 0.2%-1.0% Mg and 0.2%-1.0% Si, fulfilling {(Mg content)+(Si content)}≤1.2%, having a 20-50 μW/mg high exothermic peak within a temperature range of 230-330° C. in a differential scanning calorimetry curve, and having both excellent moldability and excellent bake hardening properties.

1 . An aluminum alloy sheet excellent in terms of formability and bake hardenability, which is an Al—Mg—Si alloy sheet comprising, in terms of mass %, Mg: 0.2-1.0% and Si: 0.2-1.0% and satisfying {(Mg content)+(Si content)}≤1.2%, with the remainder being Al and unavoidable impurities,
 wherein a differential scanning thermal analysis curve of the aluminum alloy sheet has, in a temperature range of 230-330° C., only one exothermic peak (i) or only two exothermic peaks (ii) having a temperature difference between the peaks of 50° C. or less, and 
 wherein the exothermic peak (i) or the peak having a higher peak height of the exothermic peaks (ii) has a height in a range of 20-50 μW/mg. 
 
     
     
         2 . The aluminum alloy sheet excellent in terms of formability and bake hardenability according to  claim 1 , further comprising one element or two or more elements selected from the group consisting of Fe: more than 0% and 0.5% or less, Mn: more than 0% and 0.3% or less, Cr: more than 0% and 0.3% or less, Zr: more than 0% and 0.1% or less, V: more than 0% and 0.1% or less, Ti: more than 0% and 0.1% or less, Cu: more than 0% and 0.5% or less, Ag: more than 0% and 0.1% or less, and Zn: more than 0% and 0.5% or less.