Metal additive structures on printed circuit boards

Abstract

Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.

1 . A printed circuit board comprising:
 an insulating substrate with one or more conductive metallic paths thereon; and   a multilayered metallic structure additively manufactured onto and fusion welded to the conductive metallic paths, the multilayered metallic structure additively extending away from the printed circuit board.   
     
     
         2 . The printed circuit board of  claim 1 , further comprising:
 one or more electronic components soldered to the insulating substrate, wherein the multilayered metallic structure includes a shield can wall around the electronic components and the multilayered metallic structure is not soldered to the conductive metallic paths.   
     
     
         3 . The printed circuit board of  claim 2 , further comprising:
 a shield can lid attached to the shield can wall, wherein the insulating substrate, the shield can wall, and the shield can lid in combination encompass the electronic components.   
     
     
         4 . The printed circuit board of  claim 3 , wherein the multilayered metallic structure further includes one or more internal supports within a perimeter of the shield can wall, the internal supports attached to and supporting the shield can lid. 
     
     
         5 . The printed circuit board of  claim 1 , wherein the multilayered metallic structure further includes one or more attachment features that provide additional contact area with an adjacent structure. 
     
     
         6 . The printed circuit board of  claim 1 , further comprising:
 one or more electronic components offset a predetermined distance from the printed circuit board, wherein the multilayered metallic structure serves as a frame supporting the electronic components and attaching the printed circuit board to the electronic components.   
     
     
         7 . The printed circuit board of  claim 6 , wherein the electronic components include a display. 
     
     
         8 . The printed circuit board of  claim 1 , wherein the multilayered metallic structure forms an antenna on the printed circuit board. 
     
     
         9 . The printed circuit board of  claim 8 , wherein the antenna forms a structural component of the printed circuit board. 
     
     
         10 . The printed circuit board of  claim 1 , further comprising:
 one or more electronic components soldered to the insulating substrate, wherein the multilayered metallic structure forms a heat sink that conducts thermal energy from the electronic components.   
     
     
         11 . The printed circuit board of  claim 1 , wherein the multilayered metallic structure forms one or more of a pogo pin, a leaf spring, a finger connector, and a compliant gasket. 
     
     
         12 . The printed circuit board of  claim 1 , wherein the conductive metallic paths include one or more of vias, traces, and pads on the printed circuit board. 
     
     
         13 . The printed circuit board of  claim 1 , wherein the conductive metallic paths differ in material composition from the multilayered metallic structure. 
     
     
         14 . A method of manufacturing a printed circuit board, the method comprising:
 forming one or more conductive metallic paths on an insulating substrate; and   additively manufacturing a series of layers of a metallic structure onto and fusion welded to the conductive metallic paths, the multilayered metallic structure additively extending away from the printed circuit board.   
     
     
         15 . The method of  claim 14 , wherein the conductive metallic paths are formed via one or more of subtractive, additive, and semi-additive manufacturing processes. 
     
     
         16 . The method of  claim 14 , wherein the additive manufacturing process includes one or more of selective laser melting, direct metal laser sintering, directed energy deposition, electron beam melting, and metal screen printing. 
     
     
         17 . The method of  claim 14 , wherein the conductive metallic paths include one or more of vias, traces, and pads on the printed circuit board. 
     
     
         18 . The method of  claim 14 , wherein the conductive metallic paths differ in material composition from the multilayered metallic structure. 
     
     
         19 . A shielded electronic device comprising:
 an insulating substrate with one or more conductive metallic paths traced thereon and one or more electronic components soldered thereon;   a multilayered shield can wall additively manufactured onto and fusion welded to the conductive metallic paths, the multilayered shield can wall additively extending away from the insulating substrate; and   a shield can lid attached to the shield can wall, wherein the insulating substrate, the shield can wall, and the shield can lid in combination encompass the electronic components of the shielded electronic device.   
     
     
         20 . The shielded electronic device of  claim 19 , further comprising:
 one or more internal supports additively manufactured within a perimeter of the shield can wall, the internal supports attached to and supporting the shield can lid.