Method for manufacturing laser package

Abstract

A method of manufacturing a laser package includes: providing a plurality of laser devices, each including: a submount, and an edge-emitting semiconductor laser element disposed on the submount; providing one or more optical members; providing a substrate; disposing a first bonding material and a second bonding material on the substrate; placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the laser devices and the one or more optical members to the substrate via the first and second bonding materials.

What is claimed is: 
     
         1 . A method of manufacturing a laser package comprising:
 providing a plurality of laser devices, each comprising:
 a submount, and 
 an edge-emitting semiconductor laser element disposed on the submount; 
   providing one or more optical members;   providing a substrate having an upper surface;   disposing a first bonding material containing metal nanoparticles or metal sub-micron particles and one or more organic solvent on the upper surface of the substrate at locations at which the plurality of laser devices are to be placed, and disposing a second bonding material containing metal nanoparticles or metal sub-micron particles and one or more organic solvent on the upper surface of the substrate at locations at which the one or more optical members are to be placed;   placing the plurality of laser devices on the upper surface of the substrate via the first bonding material, and placing the one or more optical members on the upper surface of the substrate via the second bonding material; and   collectively heating the plurality of laser devices and the one or more optical members on the substrate without pressing the plurality of laser devices and the one or more optical members onto the substrate, so as to bond the plurality of laser devices and the one or more optical members to the substrate via the first and second bonding materials.   
     
     
         2 . The method of manufacturing a laser package according to  claim 1 , the method further comprising, before placing the plurality of laser devices and the one or more optical members, washing lower surfaces of the submount and the optical member. 
     
     
         3 . The method of manufacturing a laser package according to  claim 1 , the method further comprising, after disposing the first bonding material and the second bonding material and before placing the plurality of laser devices and the one or more optical members, placing the first bonding material and the second bonding material disposed on the upper surface of the substrate in a vacuum device and evacuating the vacuum device. 
     
     
         4 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of collectively heating the plurality of laser devices and the one or more optical members on the substrate, the heat is applied in a vacuum state. 
     
     
         5 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, when seen from above, each of the laser devices is placed such that an end of each corresponding submount that is to face an adjacent one of the one or more optical members is located between a disposed position of the first bonding material and a disposed position of the second bonding material. 
     
     
         6 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, each of the plurality of laser devices is held by a holding member and is pressed onto the substrate via the first bonding material, and the holding member is subsequently separated from the laser device. 
     
     
         7 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, when seen from above, each of the optical members is placed such that an end of the optical member that is to face an adjacent one of the laser devices is located between a disposed position of the first bonding material and a disposed position of the second bonding material. 
     
     
         8 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, each of the one or more optical member is held by a holding member and is pressed onto the substrate via the second bonding member, and the holding member is subsequently separated from the optical member. 
     
     
         9 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, each of the submounts is brought in contact with the first bonding material such that, when viewed from above, an end of a bonded position of the first bonding material facing an adjacent one of the one or more optical members is located between a corresponding one of the laser devices and said adjacent one of the one or more optical members. 
     
     
         10 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, each optical member is brought in contact with the second bonding material such that, when viewed from above, an end of each optical member facing an adjacent one of the laser devices is located between an end of a bonded position of the first bonding material and an end of a bonded position of the second bonding material, 
     
     
         11 . The method of manufacturing a laser package according to  claim 1 , wherein, in the step of placing the plurality of laser devices and the one or more optical members, each optical member is brought in contact with the second bonding material such that, when viewed from above, an end of each optical member facing an adjacent one of the laser devices matches an end of a bonded position of the second bonding material. 
     
     
         12 . The method of manufacturing a laser package according to  claim 1 , further comprising, either in or after the step of collectively heating the plurality of laser devices and one or more optical members, plasma processing the plurality of laser devices and the one or more optical members mounted on the upper surface of the substrate. 
     
     
         13 . The method of manufacturing a laser package according to  claim 1 , wherein each of the one or more optical members comprises a light-reflecting surface configured to reflect light in an upward direction. 
     
     
         14 . The method of manufacturing a laser package according to  claim 1 , wherein the plurality of laser devices comprises at least six laser devices. 
     
     
         15 . The method of manufacturing a laser package according to  claim 14 , wherein the plurality of laser devices are placed in rows and columns.