Optical imaging device with thermal attenuation

Abstract

An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

1 . (canceled) 
     
     
         2 . A device having an immersion zone, the device comprising:
 a mask device configured to receive a mask comprising a pattern;   a projection device comprising an optical element group;   a substrate device configured to hold a substrate; and   a thermal attenuation device,   wherein:   the optical element group is configured to project a projection pattern onto the substrate;   the optical element group comprises a plurality of optical elements comprising an immersion element at least temporarily located adjacent to the immersion zone;   during use of the device, the immersion zone contains an immersion medium;   the thermal attenuation device is configured to reduce fluctuations within a temperature distribution of the immersion element induced by the immersion medium;   the thermal attenuation device comprises a shielding defining a thermal decoupling device configured to at least partial thermal decouple the immersion element from at least a part of its environment; and   the shielding comprises a thermally highly conductive layer.   
     
     
         3 . The optical imaging device of  claim 2 , wherein the shielding comprises a hydrophobic layer. 
     
     
         4 . The optical imaging device of  claim 2 , wherein the hydrophobic layer is located on a side of the highly thermally conductive layer facing away from the immersion element. 
     
     
         5 . The optical imaging device of  claim 2 , wherein the hydrophobic layer defines a surface of the at least one shielding. 
     
     
         6 . The optical imaging device of  claim 2 , wherein, during use of the optical imaging device, the immersion zone is between the immersion element and the substrate. 
     
     
         7 . The optical imaging device of  claim 2 , wherein:
 the immersion element comprises a first area optically used and a second area optically unused during use of the optical imaging device;   the shielding thermally is configured to shield at least a part of a section of the second area against the immersion medium; and   the section is the entire section of the second area located adjacent to the immersion medium.   
     
     
         8 . The optical imaging device of  claim 2 , further comprising a further shielding, wherein:
 the immersion element comprises a first area optically used and a second area optically unused during use of the optical imaging device;   the further shielding is a thermal decoupling device configured to thermally shield at least a part of a further section of the second area against an adjacent section of the projection device; and   the further section is the entire section of the second area located adjacent to the adjacent section of the projection device.   
     
     
         9 . The optical imaging device of  claim 2 , further comprising a holding device and a further shielding, wherein the immersion element is held by the holding device, and the further shielding defines a thermal decoupling device configured to thermally shield at least a part of the holding device against its environment. 
     
     
         10 . The optical imaging device of  claim 2 , wherein the shielding comprises a passive thermally insulating layer. 
     
     
         11 . The optical imaging device of  claim 10 , wherein the passive thermally insulating layer comprises an organic material. 
     
     
         12 . The optical imaging device of  claim 11 , wherein the immersion element comprises a reflective coating, and at least a part of the organic material does not contact the reflective coating. 
     
     
         13 . The optical imaging device of  claim 10 , wherein the thermally insulating layer is located immediately adjacent to the immersion element. 
     
     
         14 . The optical imaging device of  claim 2 , further comprising a heat sink thermally connected to the thermally highly conductive layer. 
     
     
         15 . The optical imaging device of  claim 2 , further comprising a thermally stabilizing device, wherein the thermally highly conductive layer is connected to the thermally stabilizing device located at a circumference of the thermally highly conductive layer. 
     
     
         16 . The optical imaging device of  claim 15 , wherein the thermally stabilizing device has a high heat capacity to have a stable temperature. 
     
     
         17 . The optical imaging device of  claim 15 , wherein the thermally stabilizing device is comprises a circuit of a heat carrier medium. 
     
     
         18 . The optical imaging device of  claim 2 , wherein a setpoint temperature distribution is given for the immersion element, and the thermal attenuation device is configured to keep a given maximum deviation from the setpoint temperature distribution. 
     
     
         19 . The optical imaging device of  claim 13 , wherein the maximum deviation is less than one mK. 
     
     
         20 . The optical imaging device of  claim 2 , wherein:
 the immersion element has an actual temperature distribution and a setpoint temperature distribution; and   the thermal attenuation device comprises:
 an establishing device; 
 a control device at least temporarily connected to the establishing device; and 
 an influencing device at least temporarily connected to the control device; 
 the establishing device is configured to establishe at least one influencing parameter influencing the actual temperature distribution or being representative of the actual temperature distribution; 
 the control device is configured to, as a function of the established influencing parameter and the setpoint temperature distribution, establish at least one control value; and 
 the influencing device is configured to, as a function of the at least one established control value, influence a control parameter influencing the actual temperature distribution in such a manner that a deviation of the actual temperature distribution from the setpoint temperature distribution is counteracted. 
   
     
     
         21 . The optical imaging device of  claim 20 , wherein:
 the influencing parameter is at least one local temperature of the immersion medium or at least one local temperature of the immersion element; and   the establishment device comprises at least one member selected from the group consisting of a temperature sensor to measure the at least one local temperature and an estimation device to estimate the at least one local temperature.   
     
     
         22 . The optical imaging device of  claim 20 , wherein the control parameter comprises at least one member selected from the group consisting of a temperature of the immersion medium, a flow rate of the immersion medium, a temperature of a gas atmosphere contacting the immersion medium, a humidity of a gas atmosphere contacting the immersion medium, a flow rate of a gas atmosphere contacting the immersion medium, and a temperature of at least one temperature adjustment element being in operative connection with the immersion element. 
     
     
         23 . The optical imaging device of  claim 20 , wherein the control device is configured to use a temperature behavior model of at least one of the immersion element and the immersion medium within the immersion zone for establishing the control value. 
     
     
         24 . Optical imaging device of  claim 2 , wherein the immersion element comprises a material from a material selected from the group consisting of a material having a refractive index larger than the refractive index of quartz glass, a material having a refractive index showing a higher temperature sensitivity than the refractive index of quartz glass, a spinel, and a LuAG. 
     
     
         25 . The optical imaging device of  claim 2 , wherein the numerical aperture at least 1.3. 
     
     
         26 . An method, comprising:
 projecting a projection pattern onto a substrate using optical elements of an optical element group,   wherein:
 an immersion element of the optical element group is at least partially immersed into an immersion medium an a area of an immersion zone; 
 a reduction of fluctuations within a temperature distribution the immersion element induced by the immersion medium is provided via a thermal attenuation device; 
 at least one shielding forming at least one thermal decoupling device of the thermal attenuation device provides an at least partial thermal decoupling of the immersion element from at least a part of its environment; 
 the at least one shielding comprises a thermally highly conductive layer.