Transmission of wireless signal having information on a local oscillator signal

Abstract

A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.

What is claimed is: 
     
         1 . A semiconductor package, comprising:
 an antenna; and   a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.   
     
     
         2 . The semiconductor package of  claim 1 , wherein the wireless signal has information on a phase of the local oscillator signal of the semiconductor package. 
     
     
         3 . The semiconductor package of  claim 2 , wherein the local oscillator signal is usable for generating a radar signal by the semiconductor package. 
     
     
         4 . The semiconductor package of  claim 3 , wherein the antenna comprises a first antenna configured to transmit the wireless signal and a second antenna configured to transmit the radar signal. 
     
     
         5 . The semiconductor package of  claim 3 , wherein the antenna is configured to transmit both the wireless signal and the radar signal. 
     
     
         6 . The semiconductor package of  claim 1 , wherein the transmitter is a multi-channel transmitter configured to transmit the wireless signal and a radar signal. 
     
     
         7 . A semiconductor package, comprising:
 an antenna; and   a semiconductor die coupled to the antenna and comprising a receiver configured to receive wirelessly via the antenna from another semiconductor package, a wireless signal having information on a local oscillator signal of the other semiconductor package.   
     
     
         8 . The semiconductor package of  claim 7 , wherein the wireless signal has information on a phase of the local oscillator signal of the other semiconductor package. 
     
     
         9 . The semiconductor package of  claim 8 , wherein the receiver is further configured to receive from the other semiconductor package a radar signal generated based on the local oscillator signal. 
     
     
         10 . The semiconductor package of  claim 9 , further comprising:
 a mixer configured to mix the wireless signal or a signal derived from the wireless signal rebuilding the local oscillator signal with the radar signal to determine a frequency offset between the local oscillator signal and the radar signal.   
     
     
         11 . The semiconductor package of  claim 9 , wherein the antenna comprises a first antenna configured to receive the wireless signal and a second antenna configured to receive the radar signal. 
     
     
         12 . The semiconductor package of  claim 9 , wherein the antenna is configured to receive both the wireless signal and the radar signal. 
     
     
         13 . A transmission method of a semiconductor package having an antenna and a semiconductor die which is coupled to the antenna and has a transmitter, comprising:
 transmitting wirelessly, by the transmitter via the antenna, a wireless signal having information on a local oscillator signal of the semiconductor package to an antenna of a further semiconductor package.   
     
     
         14 . The transmission method of  claim 13 , wherein the wireless signal has information on a phase of the local oscillator signal of the semiconductor package 
     
     
         15 . The transmission method of  claim 14 , further comprising:
 generating, using the local oscillator signal, a radar signal; and   transmitting the radar signal.   
     
     
         16 . A wireless system, comprising:
 the semiconductor package of  claim 1  as a first semiconductor package; and   a second semiconductor package, comprising:
 a second antenna; and 
 a second semiconductor die which is coupled to the second antenna and comprises a receiver configured to receive wirelessly via the second antenna from the first semiconductor package, the wireless signal. 
   
     
     
         17 . The wireless system of  claim 16 , wherein:
 the transmitter of the first semiconductor package is configured to transmit via the first antenna a radar signal, and   the receiver is configured to receive via the second antenna a reflected version of the radar signal.   
     
     
         18 . The wireless system of  claim 17 , wherein the second semiconductor package further comprises:
 a mixer configured to mix the wireless signal or a signal derived from the wireless signal rebuilding the local oscillator signal with the reflected version of the radar signal to determine a frequency offset between the local oscillator signal and the reflected version of the radar signal.   
     
     
         19 . The wireless system of  claim 18 , further comprising:
 a microcomputer configured to determine position information of an object based on the determined frequency offset.   
     
     
         20 . The wireless system of  claim 16 , wherein the first semiconductor package and the second semiconductor package are arranged on different circuit boards.