Electronic Module

Abstract

An electronic module is disclosed, wherein the electronic module comprises: a module board and a connection board, wherein a plurality of first electronic devices are disposed over a top surface of the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to a plurality of second contact points on a top surface of the connection board, wherein a plurality of third contact points are on a bottom surface of the connection board for connecting with an external circuit.

What is claimed is: 
     
         1 . An electronic module, comprising:
 a module board, wherein a plurality of first electronic devices are disposed over a top surface of the module board and electrically connected to the module board, and a plurality of second electronic devices are disposed on a bottom surface of the module board and electrically connected to the module board, wherein a plurality of first contact points are disposed on the bottom surface of the module board and electrically connected to the module board; and   a connection board, wherein a plurality of second contact points are on a top surface of the connection board, and a plurality of third contact points are on a bottom surface of the connection board, wherein the connection board are disposed under the module board, wherein each of the plurality of first contact points is electrically connected to a corresponding contact point of the plurality of second contact points, and the plurality of third contact points are electrically connected to the plurality of second contact points for connecting with an external circuit.   
     
     
         2 . The electronic module according to  claim 1 , wherein the connection board is in an open ring shape with at least one through opening surrounded by the open ring, wherein the plurality of second electronic devices are disposed in the at least one through opening. 
     
     
         3 . The electronic module according to  claim 1 , wherein the connection board is in a closed ring shape with at least one through opening surrounded by the closed ring, wherein the plurality of second electronic devices are disposed in the at least one through opening. 
     
     
         4 . The electronic module according to  claim 1 , wherein each of the plurality of third contact points is electrically connected to a corresponding one of the plurality of second contact points through a via disposed in the connection board. 
     
     
         5 . The electronic module according to  claim 1 , wherein the connection board is a multi-layer board comprising a routing trace to electrically connect a contact point of the plurality of second contact points to a corresponding contact point of the plurality of third contact points, wherein said corresponding contact point of the plurality of third contact points is not directly under said contact point of the plurality of second contact points. 
     
     
         6 . The electronic module according to  claim 1 , wherein the connection board is a multi-layer board comprising a routing trace to electrically connect two contact points of the plurality of second contact points. 
     
     
         7 . The electronic module according to  claim 1 , wherein the module board is a multi-layer circuit board. 
     
     
         8 . The electronic module according to  claim 1 , wherein the module board is a multi-layer PCB. 
     
     
         9 . The electronic module according to  claim 1 , wherein the module board comprises a metallic substrate. 
     
     
         10 . The electronic module according to  claim 1 , wherein the module board comprises a ceramic substrate. 
     
     
         11 . The electronic module according to  claim 1 , wherein each of the plurality of first contact points is a SMT pad. 
     
     
         12 . The electronic module according to  claim 1 , wherein each of the plurality of third contact points is a SMT pad. 
     
     
         13 . The electronic module according to  claim 1 , wherein the plurality of first electronic devices comprises an active device and a passive device. 
     
     
         14 . The electronic module according to  claim 1 , wherein the plurality of second electronic devices comprises an active device and a passive device. 
     
     
         15 . The electronic module according to  claim 1 , wherein each of the plurality of first electronic devices is a SMT device. 
     
     
         16 . The electronic module according to  claim 1 , wherein each of the plurality of second electronic devices is a SMT device.