Integrated microstrip and substrate integrated waveguide circulators/isolators formed with co-fired magnetic-dielectric composites

Abstract

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

1 . An integrated microstrip or substrate integrated waveguide circulator comprising:
 a dielectric substrate having an aperture;   a ferrite disc fit within the aperture in the dielectric substrate, the dielectric substrate and ferrite disc being co-fired together to contain the ferrite disc within the aperture of the dielectric substrate; and   metallization on the co-fired dielectric substrate and ferrite disc.   
     
     
         2 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  wherein the metallization is circuitry. 
     
     
         3 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  wherein the ferrite disc is a yttrium iron garnet disc. 
     
     
         4 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  wherein the circulator is configured for use in above approximately 1.8 GHz systems. 
     
     
         5 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  further including a coupler, switch, and load located on the dielectric substrate. 
     
     
         6 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  wherein no adhesive is used. 
     
     
         7 . The integrated microstrip or substrate integrated waveguide circulator of  claim 1  wherein the dielectric substrate or waveguide and ferrite disc are co-fired at a temperature of at least 1000° C. 
     
     
         8 . A method of forming a co-fired integrated microstrip or substrate integrated waveguide circulator, the method comprising:
 preparing a ferrite disc;   preparing a dielectric substrate, the dielectric substrate having an aperture;   translating the ferrite disc into the aperture in the dielectric substrate to form a composite structure;   co-firing the composite structure to shrink the dielectric substrate around the ferrite disc; and   metallizing the co-fired composite structure.   
     
     
         9 . The method of  claim 8  wherein the ferrite disc is a yttrium iron garnet disc. 
     
     
         10 . The method of  claim 8  wherein the co-firing is at a temperature of at least 1000° C. 
     
     
         11 . The method of  claim 8  further including adding additional radio frequency components onto the dielectric substrate. 
     
     
         12 . The method of  claim 8  further including slicing the composite structure to a particular thickness, wherein each slice contains both a portion of the ferrite disc and a portion of the dielectric substrate or waveguide. 
     
     
         13 . The method of  claim 8  further including contacting a magnetic disc onto the composite structure to form a microstrip or substrate integrated waveguide circulator. 
     
     
         14 . The method of  claim 8  wherein no adhesive is used. 
     
     
         15 . The method of  claim 8  further including applying a coupler, switch, and load to the dielectric substrate. 
     
     
         16 . A radio frequency antenna system comprising:
 a dielectric substrate having an aperture;   a ferrite disc fit within the aperture in the dielectric substrate, the dielectric and ferrite disc being co-fired together to contain the ferrite disc within the aperture of the dielectric substrate or waveguide;   metallization on the co-fired dielectric substrate and ferrite disc;   a transmit power amplifier;   a receive low noise amplifier; and   a filter.   
     
     
         17 . The radio frequency antenna system of  claim 16  further including a semiconductor amplifier. 
     
     
         18 . The radio frequency antenna system of  claim 16  further including a coupler, switch, and load located on the dielectric substrate. 
     
     
         19 . The radio frequency antenna system of  claim 16  wherein the system is configured to operate as a 5G system. 
     
     
         20 . The radio frequency antenna system of  claim 16  wherein no adhesive is used.