Optical module including silicon photonics chip and coupler chip

Abstract

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

What is claimed is: 
     
         1 . An optical module comprising:
 a Silicon Photonics chip that includes a waveguide that transports light signals; and   a coupler chip attached to the Silicon Photonics chip so that the light signals are transported along a light path between the Silicon Photonics chip and the coupler chip; wherein   the coupler chip changes a cross-sectional size of a beam defined by the light signals; and   the coupler chip includes only one of a multiplexer and a demultiplexer, or the coupler chip includes both a multiplexer and a demultiplexer.   
     
     
         2 . The optical module of  claim 1 , wherein the only one of the multiplexer and the demultiplexer, or both the multiplexer and the demultiplexer include at least one of an Echelle grating, an arrayed waveguide grating, a directional coupler, a dichroic filter, or a resonant interference filter. 
     
     
         3 . The optical module of  claim 1 , wherein the cross-sectional size of the beam is largest at an interface between the Silicon Photonics chip and the coupler chip. 
     
     
         4 . The optical module of  claim 1 , wherein the cross-sectional size of the beam initially increases along the light path and then decreases along the light path. 
     
     
         5 . The optical module of  claim 1 , wherein a photodetector is surface mounted to the Silicon Photonics chip. 
     
     
         6 . The optical module of  claim 1 , wherein a photodetector is included within the Silicon Photonics chip. 
     
     
         7 . The optical module of  claim 1 , wherein a light source is included within the Silicon Photonics chip. 
     
     
         8 . The optical module of  claim 1 , further comprising a light source located outside of the Silicon Photonics chip; wherein
 light from the light source is supplied to the Silicon Photonics chip.   
     
     
         9 . The optical module of  claim 1 , wherein the Silicon Photonics chip includes a via in the light path. 
     
     
         10 . The optical module of  claim 1 , wherein the Silicon Photonics chip and the coupler chip are anodically bonded to each other. 
     
     
         11 . The optical module of  claim 1 , wherein the coupler chip includes a borosilicate glass having a coefficient of thermal expansion substantially similar to silicon. 
     
     
         12 . The optical module of  claim 1 , wherein:
 the light path includes a first surface of the coupler chip and a second surface of the coupler chip; and   the cross-sectional size of the beam is different at the first and second surfaces.   
     
     
         13 . The optical module of  claim 12 , wherein at least one of the Silicon Photonics chip and the coupler chip includes a focusing element. 
     
     
         14 . The optical module of  claim 13 , wherein the focusing element is a collimating lens. 
     
     
         15 . The optical module of  claim 12 , wherein the coupler chip includes a borosilicate glass having a coefficient of thermal expansion substantially similar to silicon. 
     
     
         16 . The optical module of  claim 1 , wherein the coupler chip only has optical functionality. 
     
     
         17 . A transceiver comprising:
 the optical module of  claim 1 ; and   a printed circuit board; wherein   the Silicon Photonics chip is connected to the printed circuit board.   
     
     
         18 . The transceiver of  claim 17 , further comprising a housing enclosing the Silicon Photonics chip and the coupler chip. 
     
     
         19 . The transceiver of  claim 18 , further comprising a latch that secures the coupler chip in the housing; wherein
 the coupler chip is detachable from the housing by unlatching the latch.