Random Walk Polishing Machine

Abstract

A polishing machine for fine polishing and abrading work configured to employ a random walk theory algorithm to generate the movement pattern of the polishing or abrading element.

1 . A machine for polishing a workpiece, the machine comprising:
 a supporting surface for securing and supporting the workpiece;   a polishing surface for polishing the workpiece;   a mounting arrangement for supporting said supporting surface and said polishing surface;   a movement arrangement for moving said polishing surface with respect to said supporting surface and across said workpiece;   a control system in electronic communication with said movement arrangement for directing the movement of said polishing surface with said control system configured to generate a sequence of displacement commands by means of generating a series of random numbers, assigning movement directions to each random number in said series such that the sum of the random numbers corresponding to each of the assigned movement directions equals zero;   whereby said polishing surface, in response to said sequence of displacement commands, moves across said workpiece in a number of non-repeating polishing paths.   
     
     
         2 . The machine for polishing a workpiece of  claim 1  wherein said movement arrangement comprises a horizontal platform configured to move said polishing surface in its horizontal plane and a vertical platform configured to move said polishing surface in its vertical plane in response to said sequence of displacement commands, wherein said horizontal platform further comprises an x-axis motor and at least one horizontal sensor configured to control and limit movement of said horizontal platform and wherein said vertical platform comprises a y-axis motor and at least one vertical sensor configured to control and limit movement of said vertical platform. 
     
     
         3 . The machine for polishing a workpiece of  claim 1  wherein said polishing surface has either a plane or curved shape and said polishing surface executes random-walk movements across said workpiece wherein said random-walk movements do not replicate a planetary movement or figure-eight pattern movement. 
     
     
         4 . The machine for polishing a workpiece of  claim 1  wherein the polishing surface comprises a removable sanding pad. 
     
     
         5 . The machine for polishing a workpiece of  claim 1  wherein the supporting surface comprises embedded supports to support the workpiece. 
     
     
         6 . A machine for polishing a workpiece comprising:
 a supporting surface for securing and supporting the workpiece;   a polishing surface for polishing the workpiece;   a mounting arrangement for supporting said supporting surface and said polishing surface with said mounting arrangement configured in a generally cylindrical shape and comprising a base, a casing and an upper plate;   a movement arrangement for moving said polishing surface with respect to said supporting surface and across said workpiece with said movement arrangement housed within the said casing of said mounting arrangement and comprising a first oscillatory motor situated below a second oscillatory motor and with a first eccentric ball bearing disposed on the top of the first oscillatory motor and a second eccentric ball bearing disposed on top of the second oscillatory motor and with the movement arrangement further configured such that the second eccentric ball bearing is in contact with the polishing surface;   a first power source to operate the first oscillatory motor and a second power source to operated the second oscillatory motor,   whereby said polishing surface moves across said workpiece in a number of random polishing paths generated by the combined operation of the first oscillatory motor operating at a first frequency and the second oscillatory motor operating at a second frequency.   
     
     
         7 . The machine for polishing a workpiece of  claim 6  wherein the first oscillatory motor is coupled to the second oscillatory motor by means of a flange. 
     
     
         8 . The machine for polishing a workpiece of  claim 6  wherein the movement arrangement is secured within the case of the mounting arrangement by means of a blocking ring. 
     
     
         9 . The machine for polishing a workpiece of  claim 6  wherein the upper plate of said mounting arrangement further comprises a rubber sanding pad. 
     
     
         10 . The machine for polishing a workpiece of  claim 6  wherein the polishing surface comprises removable sanding pads. 
     
     
         11 . The machine for polishing a workpiece of  claim 6  wherein the supporting surface comprises embedded supports for supporting the workpiece. 
     
     
         12 . The machine for polishing a workpiece of  claim 6  wherein said polishing surface has either a plane or curved shape and said polishing surface executes random-walk movements across said workpiece wherein said random-walk movements do not replicate a planetary movement or figure-eight pattern. 
     
     
         13 . A method for polishing a workpiece comprising the steps of:
 Generating and storing a random set of numbers;   Assigning a directional displacement value to each number;   Selecting from the stored set of numbers a subset of the numbers whose sum equals zero;   Translate the displacement value of each number in the subset into a movement command;   Communicate that movement command to a polishing surface for movement of said polishing surface over a workpiece.   
     
     
         14 . The method for polishing a workpiece of  claim 13  further comprising the steps of:
 Securing a workpiece to a support apparatus; 
 Disposing the workpiece on a polishing surface; 
 transmitting an oscillatory movement generated by the operation of coupled oscillatory motors disposed within a support housing secured to said polishing surface; 
 operating the coupled oscillatory motors at different frequencies; 
 and transmitting the oscillatory motion of the coupled oscillatory motors to the polishing surface.