Capacitor Arrangement

Abstract

A capacitor arrangement is disclosed. In an embodiment the arrangement includes a ceramic multilayer capacitor including a main body comprising ceramic layers, first electrode layers and second electrode layers arranged there between and a first external contact and a second external contact on mutually opposite side surfaces, wherein the first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers.

What is claimed is: 
     
         1 . A capacitor arrangement comprising:
 a ceramic multilayer capacitor comprising:
 a main body comprising ceramic layers, first electrode layers and second electrode layers arranged there between; and 
 a first external contact and a second external contact on mutually opposite side surfaces, 
 wherein the first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers, 
 wherein the main body has third electrode layers between the ceramic layers, the third electrode layers being electrically conductively connected to no external contact and overlapping with the first and second electrode layers, 
 wherein each layer of the first, second and third electrode layers comprises a base metal, 
 wherein the ceramic layers comprise an antiferroelectric dielectric material, 
 wherein the ceramic layers are arranged along a layer stacking direction to form a stack, 
 wherein the main body has a width B along a layer stacking direction, 
 wherein the main body has a height H along a direction perpendicular to side surfaces on which the first and second external contacts are located, 
 wherein the main body has a length L along a direction perpendicular to the height H and perpendicular to the width B, and 
 wherein B/H≥1, L/B≥1 and L/H≥1. 
   
     
     
         2 . The capacitor arrangement according to  claim 1 , wherein the first, second and third electrode layers consist essentially of copper. 
     
     
         3 . The capacitor arrangement according to  claim 1 , wherein the side surfaces on which the first and second external contacts are located are lapped or ground. 
     
     
         4 . The capacitor arrangement according to  claim 1 , further comprising
 a first metallic contact plate electrically conductively connected to the first external contact; and   a second metallic contact plate electrically conductively connected to the second external contact, and   wherein the ceramic multilayer capacitor is arranged between the first metallic contact plate and the second metallic contact plate.   
     
     
         5 . The capacitor arrangement according to  claim 4 , wherein the first metallic contact plate and the second metallic contact plate comprise copper plates or copper plates passivated with gold or silver. 
     
     
         6 . The capacitor arrangement according to  claim 4 , further comprising:
 a first metallic grid arranged between the first external contact and the first metallic contact plate; and   a second metallic grid is arranged between the second external contact and the second metallic contact plate.   
     
     
         7 . The capacitor arrangement according to  claim 6 , wherein the first metallic grid and the second metallic grid is a copper grid. 
     
     
         8 . The capacitor arrangement according to  claim 4 , further comprising:
 a first solder layer arranged between the first external contact and the first metallic contact plate; and   a second solder layer arranged between the second external contact and the second metallic contact plate.   
     
     
         9 . The capacitor arrangement according to  claim 8 , wherein each of the first and second solder layers comprises a nanosilver solder layer. 
     
     
         10 . The capacitor arrangement according to  claim 4 , wherein a plurality of ceramic multilayer capacitors are arranged between the first and second metallic contact plates. 
     
     
         11 . The capacitor arrangement according to  claim 1 , wherein each of the first and second external contacts has a sputtering layer comprising a Cr/Cu/Au layer sequence, a Cr/Cu/Ag layer sequence, a Cr/Ni/Au layer sequence or Cr/Ni/Ag layer sequence, and wherein each sputtering layer is in direct contact with a first electrode layer or a second electrode layer. 
     
     
         12 . The capacitor arrangement according to  claim 1 , wherein the ceramic layers comprise a ceramic material according to the following formula:
   Pb (1-1.5a-0.5b+1.5d+e+0.5f) A a B b (Zr 1-x Ti x ) 1-c-d-e-f Li d CeFe f Si c O 3   +y PbO,   
       wherein
 A comprises an element selected from the group consisting of La, Nd, Y, Eu, Gd, Tb, Dy, Ho, Er and Yb; 
 B comprises an element selected from the group consisting of Na, K and Ag; 
 C comprises an element selected from the group consisting of Ni, Cu, Co and Mn; and 
 0<a<0.12, 0.05≤x≤0.3, 0≤b≤0.12, 0≤c≤0.12, 0≤d<0.12, 0≤e<0.12, 0≤f<0.12, 0≤y<1 and b+d+e+f>0. 
 
     
     
         13 . The capacitor arrangement according to  claim 1 , wherein the main body has at least ten ceramic layers.