High efficiency thermal conductivity structure

Abstract

A high efficiency thermal conductivity structure includes a substrate, and plural thermally conductive wires formed on both surfaces of the substrate. The substrate is capable of forming the thermally conductive wires made of a high thermal conductivity material by a physical or chemical method. The thermally conductive wire includes a carbon nanotube or a tubular or columnar material with high thermal conductivity. The thermally conductive wire has a diameter or cross section in microscale or nanoscale size, a length in nanoscale to millimeter-scale size. During use, the thermal conductivity structure is placed between a heat source and a cooling unit. Heat from a heat source is conducted through the thermally conductive wire to the substrate. After the heat at the substrate re-adjusts its heat conduction path, the heat can be conducted from the thermally conductive wire on the other surface to the cooling unit efficiently.

What is claimed is: 
     
         1 . A high efficiency thermal conductivity structure, comprising:
 a substrate, having a plurality of thermally conductive wires formed on both surfaces of the substrate respectively; wherein the thermally conductive wires are configured to be in a columnar or tubular shape, and the thermally conductive wires have a cross-sectional length of a microscale or nanoscale size, and the thermally conductive wires are of a nanoscale to millimeter-scale size; and the substrate and the thermally conductive wire are made of a material of a high thermal conductivity.   
     
     
         2 . The high efficiency thermal conductivity structure of  claim 1 , wherein the thermally conductive wires are formed on both surfaces of the substrate respectively by a physical method or chemical method. 
     
     
         3 . The high efficiency thermal conductivity structure of  claim 1 , wherein the substrate is capable of forming the thermally conductive wires made of a high thermal conductivity material thereon by a physical method or chemical method, and the substrate is made of a material selected from the group consisting of copper, aluminum, silver, carbon, and diamond film. 
     
     
         4 . The high efficiency thermal conductivity structure of  claim 1 , wherein the thermally conductive wires are made of a material of a high thermal conductivity and in a columnar or tubular shape, and the thermally conductive wires are made of a material selected from the group consisting of carbon nanotube, aluminum, copper, and silver. 
     
     
         5 . The high efficiency thermal conductivity structure of  claim 1 , wherein the substrate is configured to be in the shape of a sheet or in any geometric shape. 
     
     
         6 . The high efficiency thermal conductivity structure of  claim 1 , further comprising a heat source and a cooling unit, and the substrate being disposed between the heat source and the cooling unit, and the thermally conductive wire at one of the surfaces of the substrate being coupled to the heat source, the thermally conductive wire at the other surface of the substrate being coupled to the cooling unit. 
     
     
         7 . The high efficiency thermal conductivity structure of  claim 1 , further comprising a heat source, the thermally conductive wire at one of the surfaces of the substrate being coupled to the heat source, and the thermally conductive wire at the other surface of the substrate being exposed to air. 
     
     
         8 . The high efficiency thermal conductivity structure of  claim 7 , wherein the thermally conductive wire at the other surface of the substrate is pressed and formed into a fin-shape.