Copper alloy wire and manufacturing method thereof

Abstract

A copper alloy wire and a manufacturing method thereof are provided. The copper alloy wire includes: by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. The method for manufacturing the copper alloy wire is performing two-phase vacuum melting: first performing vacuum electric arc melting into a copper-titanium mother alloy, and then performing vacuum induction melting with remaining components into a copper alloy wire material by means of continuous casting; then drawing the copper alloy wire material into a copper alloy fine wire by a non-slip wire drawing device in a material even-flow wire drawing manner, and finally performing thermal treatment on the copper alloy fine wire by using argon as a protection gas, so as to complete a process of the copper alloy wire.

What is claimed is: 
     
         1 . A method for manufacturing a copper alloy wire, comprising:
 performing a vacuum melting step: melting titanium, argent, and copper into a molten copper alloy;   performing a continuous casting step: manufacturing the molten copper alloy into a copper alloy wire material;   performing a wire drawing step: drawing the copper alloy wire material into a copper alloy fine wire; and   performing a thermal treatment step: performing thermal treatment on the copper alloy fine wire under a condition that an annealing temperature is 580° C. to 700° C., so as to complete a copper alloy wire.   
     
     
         2 . The method for manufacturing a copper alloy wire according to  claim 1 , wherein the copper alloy wire comprises: by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities. 
     
     
         3 . The method for manufacturing a copper alloy wire according to  claim 1 , wherein in the vacuum melting step, two-phase melting is performed in a vacuum manner and comprises steps of: first melting a total share of titanium and a partial share of copper into a copper-titanium mother alloy by means of electric arc melting, and then melting the copper-titanium mother alloy with a total share of argent and a remaining share of copper together into the molten copper alloy by means of induction melting. 
     
     
         4 . The method for manufacturing a copper alloy wire according to  claim 1 , wherein a wire diameter of the copper alloy wire material ranges between 4 mm and 8 mm, and a wire diameter of the copper alloy fine wire ranges between 10 μm and 20 μm. 
     
     
         5 . The method for manufacturing a copper alloy wire according to  claim 1 , wherein the copper alloy wire material is drawn into the copper alloy fine wire by a wire drawing device. 
     
     
         6 . The method for manufacturing a copper alloy wire according to  claim 5 , wherein the wire drawing device is a non-slip wire drawing device; in the wire drawing step, the non-slip wire drawing device comprises a tension control apparatus and an eye mold, and the tension control apparatus is configured to increase a back drawing force of the copper alloy wire material behind the eye mold. 
     
     
         7 . The method for manufacturing a copper alloy wire according to  claim 6 , wherein the non-slip wire drawing device performs a wire drawing process on the copper alloy wire material at a speed of 100 to 1000 m/min at room temperature. 
     
     
         8 . The method for manufacturing a copper alloy wire according to  claim 1 , wherein argon is used as a protection gas in the thermal treatment process. 
     
     
         9 . A copper alloy wire, comprising the following elements:
 by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.   
     
     
         10 . A copper alloy wire, only consisting of the following elements:
 by weight percentage of components, 0.3 to 0.45 of argent, 0.01 to 0.02 of titanium, and a remaining part that is formed by copper and unavoidable impurities.