Subfloor Leveling Assembly

Abstract

A subfloor leveling assembly includes a leveling device, plurality of panels and an adhesive. The leveling device is configured to identify a high spot and a low spot of a subfloor. The panels are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. Top faces of the panels are coplanarly positionable. The adhesive is configured to couple the plurality of panels to the subfloor.

1 . A subfloor leveling assembly comprising:
 a leveling device configured for identifying a high spot and a low spot of a subfloor;   a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable;   an adhesive configured for coupling said plurality of panels to the subfloor; and   wherein said leveling device is configured for identifying the high spot and the low spot of a subfloor, wherein said panels are configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable, wherein said adhesive is configured for coupling said plurality of panels to the subfloor;   each said panel comprising a first layer and a second layer, said first layer being rigid, said second layer being deformable;   each said panel comprising a plurality of penetrations positioned perpendicularly through said first layer;   a plurality of screws configured for coupling said panel to the subfloor, each said screw being positioned through a respective said penetration; and   wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor, and wherein said screws are configured for compression of said second layer between said first layer and the subfloor such that said top faces of said panels are coplanarly positionable.   
     
     
         2 . The assembly of  claim 1 , further including said panels being squarely shaped. 
     
     
         3 . (canceled) 
     
     
         4 . The assembly of  claim 1 , further including said first layer comprising plastic. 
     
     
         5 . The assembly of  claim 4 , further including said first layer comprising polyvinyl chloride. 
     
     
         6 . The assembly of  claim 4 , further including said first layer comprising polyvinyl butyrate. 
     
     
         7 . The assembly of  claim 4 , further including said first layer comprising polyvinylidene chloride. 
     
     
         8 . The assembly of  claim 1 , further including said second layer comprising polyurethane. 
     
     
         9 . (canceled) 
     
     
         10 . The assembly of  claim 1 , further including said plurality of penetrations comprising a first hole centrally positioned in said panel, said plurality of penetrations comprising four second holes, each said second hole being positioned between said first hole and a respective corner of said panel. 
     
     
         11 . The assembly of  claim 1 , further including each said screw being positioned in said respective said penetration such that a head of said screw is positioned below said top face of said panel, such that said head does not protrude from said panel. 
     
     
         12 . The assembly of  claim 1 , further including said adhesive being configured to harden said second layer such that said second layer is resistant to compression. 
     
     
         13 . A subfloor leveling assembly comprising:
 a leveling device configured for identifying a high spot and a low spot of a subfloor;   a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable, said panels being squarely shaped, each said panel comprising a first layer and a second layer, said first layer being rigid, said first layer comprising plastic, said first layer comprising polyvinyl chloride, said first layer comprising polyvinyl butyrate, said first layer comprising polyvinylidene chloride, said second layer being deformable, said second layer comprising polyurethane;   each said panel comprising a plurality of penetrations positioned perpendicularly through said first layer, said plurality of penetrations comprising a first hole centrally positioned in said panel, said plurality of penetrations comprising four second holes, each said second hole being positioned between said first hole and a respective corner of said panel;   each said panel comprising a plurality of screws configured for coupling said panel to the subfloor, each said screw being positioned through a respective said penetration, wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor, and wherein said screws are configured for compression of said second layer between said first layer and the subfloor such that said top faces of said panels are coplanarly positionable, each said screw being positioned in said respective said penetration such that a head of said screw is positioned below said top face of said panel, such that said head does not protrude from said panel;   an adhesive configured for coupling said plurality of panels to the subfloor, said adhesive being configured to harden said second layer such that said second layer is resistant to compression; and   wherein said leveling device is configured for identifying the high spot and the low spot of a subfloor, wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor such that said screws are configured for compression of said second layer between said first layer and the subfloor, wherein said top faces of said panels are coplanarly positionable, wherein said adhesive is configured for coupling said plurality of panels to the subfloor, and wherein said adhesive is configured to harden said second layer such that said second layer is resistant to compression.   
     
     
         14 . A method for leveling a subfloor, the steps of the method comprising:
 providing a subfloor leveling assembly comprising:
 a leveling device, 
 a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to a subfloor such that top faces of said panels are coplanarly positionable, and 
 an adhesive configured for coupling said plurality of panels to the subfloor; 
   utilizing said leveling device, identifying a high spot and a low spot of the subfloor;   positioning a respective said panel atop the high spot;   adjusting said respective said panel such that said top face of said respective said panel is level;   adhering said respective said panel to the subfloor by positioning of said adhesive between said respective said panel and the subfloor;   positioning and adjusting of additional said panels adjacent to said respective said panel such that said top faces are coplanarly positioned; and   coupling said additional said panels to the subfloor by positioning of said adhesive between said additional said panels and the subfloor.