Method for improving ground
Abstract
A method for improving ground is capable of preventing a clod whose representative size is large from remaining in the ground. The method for improving ground includes cutting a ground by injecting a cutting fluid (e.g. high-pressure water or high-pressure air: including a case where a solidification material is injected) from jet devices, feeding a solidification material, mixing the cut ground, the cutting fluid and the solidification material, and agitating a mixture thereof to form an underground consolidated body. A plurality of nozzles are located at an interval in a vertical direction in the jet devices, and when the cutting fluid is injected, a cutting fluid is injected from an upward nozzle in a downward skewed direction, and a cutting fluid is injected from a downward nozzle in an upward skewed direction.
Claims
exact text as granted — not AI-modified1 . A method for improving ground comprising the steps of: cutting a ground by injecting a cutting fluid from jet devices; feeding a solidification material; mixing a cut ground, the cutting fluid and the solidification material; and agitating a mixture thereof to form an underground consolidated body, wherein
a plurality of nozzles are located at an interval in a vertical direction in the jet devices, and when the cutting fluid is injected, a cutting fluid jet is injected from an upward nozzle in a downward skewed direction, and a cutting fluid jet is injected from a downward nozzle in an upward skewed direction.
2 . The method for improving ground according to claim 1 , wherein the method for improving ground comprises a step of adjusting the angle of the nozzles.
3 . The method for improving ground according to claim 1 , wherein the method for improving ground comprises a step of adjusting the interval between the nozzles in a vertical direction.
4 . The method for improving ground according to claim 2 , wherein the method for improving ground comprises a step of adjusting the interval between the nozzles in a vertical direction.Join the waitlist — get patent alerts
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