US2018108609A1PendingUtilityA1

Sensor device

Assignee: RENESAS ELECTRONICS CORPPriority: Sep 5, 2013Filed: Dec 15, 2017Published: Apr 19, 2018
Est. expirySep 5, 2033(~7.1 yrs left)· nominal 20-yr term from priority
H10W 20/427H10W 20/497H01L 28/10G01R 33/06G01R 31/2607H01L 23/5227H01F 27/2804H01L 23/5286H10D 1/20G01R 15/181H01F 2017/0073G01R 21/00H01F 21/00
46
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Claims

Abstract

A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3 ). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.

Claims

exact text as granted — not AI-modified
1 - 9 . (canceled) 
     
     
         10 . A sensor device comprising:
 a power line;   a first inductor; and   a first circuit,   wherein, in a plan view, the first circuit is in a region surrounded by the first inductor, and   wherein, in the plan view, the power line wraps around the first inductor.   
     
     
         11 . The sensor device according to  claim 10 , further comprising:
 a second inductor; and   a second circuit,   wherein, in the plan view, the second circuit is in a region surrounded by the second inductor,   wherein, in the plan view, the first inductor and the second inductor are arranged side by side, and   wherein, in the plan view, the power line wraps around the first inductor in a first direction that is either clockwise or counterclockwise, and wraps around the second inductor in a second direction opposite to the first direction.   
     
     
         12 . The sensor device according to  claim 10 ,
 wherein the first circuit comprises a digital circuit and an analog circuit.

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