Tunable three dimensional inductor

Abstract

A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process.

What is claimed is: 
     
         1 . A three-dimensional (3D) inductor, comprising:
 an array of vias in a first layer;   a plurality of interconnects in a second layer, wherein the plurality of interconnects connect the array of vias on one end of the array of vias; and   a plurality of wires that connect a subset of the array of vias on the other end of the array of vias so as to form the 3D inductor, wherein each of the plurality of wires protrudes away from a top surface of the first layer with a spacing disposed between each of the plurality of wires and the top surface of the first layer, and wherein an inductance value of the 3D inductor is based on at least one of a height of the plurality of wires, turns of the plurality of wires, and a pitch of the array of vias.   
     
     
         2 . The 3D inductor of  claim 1 , wherein:
 the plurality of wires and the array of vias are each made of metal.   
     
     
         3 . The 3D inductor of  claim 1 , wherein:
 the inductance value of the 3D inductor increases when the height of the plurality of wires increases.   
     
     
         4 . The 3D inductor of  claim 1 , wherein:
 the inductance value of the 3D inductor increases when the pitch of the array of vias increases.   
     
     
         5 . The 3D inductor of  claim 1 , wherein:
 the inductance value of the 3D inductor increases when the turns of the plurality of wires increase.   
     
     
         6 . The 3D inductor of  claim 1 , wherein:
 the first layer comprises a molding compound.   
     
     
         7 . The 3D inductor of  claim 1 , wherein:
 the first layer comprises a substrate.   
     
     
         8 . The 3D inductor of  claim 1 , wherein:
 the first layer comprises a molding compound and a substrate.   
     
     
         9 . A three-dimensional (3D) inductor, comprising:
 a plurality of vias extending through a first layer;   a plurality of interconnects disposed over a second layer, wherein the plurality of interconnects connect the plurality of vias in the first layer on one end of the vias; and   a plurality of wires that connect the plurality of vias on the other end of the vias to form the 3D inductor, wherein each of the plurality of wires protrudes away from a surface of the first layer to cause each of the plurality of wires to have at least a portion to be laterally spaced apart from the surface of the first layer, and wherein an inductance value of the 3D inductor is determined based on at least one of a height of the plurality of wires, turns of the plurality of wires, and a pitch of the plurality of vias.   
     
     
         10 . The 3D inductor of  claim 9 , wherein:
 the plurality of wires and the plurality of vias are made of metal.   
     
     
         11 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the height of the plurality of wires increases.   
     
     
         12 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the pitch of the plurality of vias increases.   
     
     
         13 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the turns of the plurality of wires increase.   
     
     
         14 . The 3D inductor of  claim 9 , wherein:
 the first layer is disposed either above or below the second layer.   
     
     
         15 . The 3D inductor of  claim 9 , wherein:
 the plurality of wires are embedded in a molding compound.   
     
     
         16 . The 3D inductor of  claim 1 , wherein:
 the first layer comprises a molding compound and/or a substrate.   
     
     
         17 . A three-dimensional (3D) inductor, comprising:
 a plurality of vias extending through a substrate or a molding compound;   a plurality of interconnects connect the plurality of vias on one end of the vias;   a plurality of wires that connect the plurality of vias on the other end of the vias to form the 3D inductor, wherein each of the plurality of wires protrudes away from a surface of the substrate or the molding compound with a spacing disposed between each of the plurality of wires and the surface of the substrate or the molding compound, and wherein an inductance value of the 3D inductor is determined based on at least one of a height of the plurality of wires that corresponds to a distance from a top of each of the plurality of wires to the surface of the substrate or the molding compound, a pitch that corresponds to a distance between a pair of the plurality of vias, and a number of the plurality of wires.   
     
     
         18 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the height of the plurality of wires increases.   
     
     
         19 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the pitch increases.   
     
     
         20 . The 3D inductor of  claim 9 , wherein:
 the inductance value of the 3D inductor increases when the number of the plurality of wires increases.